Polishing method
a technology of polishing tape and surface, applied in the direction of edge grinding machines, manufacturing tools, lapping machines, etc., can solve the problems difficult to bring the polishing tape into contact with the polishing start position, and difficult to achieve good polishing profile, prevent the occurrence of insufficient polishing or uneven polishing
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example 1
[0076]Polishing of an edge portion of a substrate was carried out using the polishing apparatus shown in FIG. 2. A tape having #4000 diamond abrasive particles fixed thereon was used as a polishing tape, and a resin pad whose lower end, which is to make contact with the polishing tape, has a radius of curvature of 0.5 mm was used as the pressing pad of the polishing head. While allowing the polishing tape to travel at a speed of 10 mm / min, the polishing tape was pressed against a polishing start position in the edge portion of the substrate, rotating at 500 rpm, at a load of 10 N by the pressing pad of the polishing head whose position was fixed, thereby polishing the edge portion at the polishing start position for 20 seconds. Thereafter, polishing was continued by pressing the polishing tape against the edge portion of the substrate, rotating at 500 rpm, at a load of 10 N while moving the polishing head toward the peripheral end of the substrate at a movement speed of 5 μm / min. Th...
example 2
[0078]Polishing of an edge portion of the same substrate was carried out in the same manner as in Example 1 except that the edge portion at the polishing start position was polished for 40 seconds. The results of the polishing, i.e., the relationship between polishing amount and radial position (measurement position) on the substrate, are shown in FIG. 8.
comp.example 1
Comp. Example 1
[0079]Polishing of an edge portion of the same substrate was carried out in the same manner as in Example 1 except that polishing of the edge portion of the substrate was started by pressing the polishing tape against the polishing start position in the edge portion of the substrate, rotating at 500 rpm, at a load of 10 N by the pressing pad of the polishing head and, immediately after the start of polishing, the polishing head was moved toward the peripheral end of the substrate at a movement speed of 5 μm / min. The results of the polishing, i.e., the relationship between polishing amount and radial position (measurement position) on the substrate, are shown in FIG. 9.
[0080]As can be seen in FIGS. 7 through 9, the inclination at the boundary between the polished surface and the non-polished surface is steeper in Examples 1 and 2 than in Comp. Example 1. Further, the inclination is steeper in Example 2 than in Example 1.
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Abstract
Description
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