Camera Module with Premolded Lens Housing and Method of Manufacture

Abstract

A novel digital camera module includes an image capture device, a circuit substrate, a lens unit and a housing that is mounted to the circuit substrate before the image capture device is mounted to the circuit substrate. In one particular embodiment, the housing is formed onto the circuit substrate via molding. The housing includes a bore to receive the lens unit, with the diameter of the bore being larger than the diagonal of the image capture device such that image capture device can be mounted to the circuit substrate through the bore. In another particular embodiment, the circuit substrate includes an aperture so as to facilitate the flip-chip bonding of the image capture device. The order in which the image capture device and the housing are coupled to the circuit substrate helps prevent damage to the image capture device during the mounting of the housing to the circuit substrate.

Description

RELATED APPLICATIONS[0001]This application is a continuation of co-pending U.S. patent application Ser. No. 11 / 444,277, filed May 31, 2006 by the same inventors, which is incorporated herein by reference in its entirety.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates generally to digital cameras, and more particularly to digital camera modules that can be mounted in host electronic devices. Even more particularly, the present invention relates to a process for manufacturing a digital camera module that substantially reduces potential damage to an image capture device during the manufacturing the digital camera or digital camera module.[0004]2. Description of the Background Art[0005]Digital camera modules are currently being incorporated into a variety of electronic devices. Such camera hosting devices include, but are not limited to, cellular telephones, personal digital assistants (PDAs), and computer cams. The demand for digital camera...

AI Technical Summary

Benefits of technology

[0009]The present invention overcomes the problems associated with the prior art by providing a digital camera module and a method of manufacturing the camera module, wherein the housing is mounted to the circuit substrate before the image capture device is mounted to the circuit substrate. Mounting the housing onto the circuit substrate before mounting the image capture device onto the circuit substrate prevents the image capture device from being damaged during the housing attachment process. In addition, having the housing attached to the circuit substrate provides a more robust substrate to mount the image capture device on.

[0011]In one embodiment, the structure of the housing facilitates the later mounting of the image capture device. The housing includes a bore with a diameter that is larger than a diagonal of the image capture device, so the image capture device can be mounted through the bore. In another embodiment, the position of the housing facilitates the later mounting of the image capture device. The housing is fixed to one surface (e.g., the top) of the circuit substrate and the image capture device is mounted to the opposite surface (e.g., the bottom) of the circuit substrate. In this embodiment, the circuit substrate defines an aperture and the image capture device is mounted so that light passing through the aperture impinges on a light sensitive portion of the image capture device.

Problems solved by technology

The image capture devices are very sensitive, which is a disadvantage in terms of manufacturing time, cost, quality, and yield of the camera module.

The image capture device is extremely vulnerable to damage and contamination, particularly before and during the housing attach process.

For example, before the housing is attached to the circuit substrate, the wire bonds are exposed to inadvertent contact (e.g., during handling), which can cause damage.

Further, the image capture device is vulnerable to contamination from particulate debris caused by the housing attach process.

Contamination of the sensor array will block light and cause visible artifacts in every image captured by the device.

Obviously, damaged image capture devices causes a decrease in product yield and an increase in labor and material costs.

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