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Evaporating method for forming thin film

a technology of evaporation method and thin film, which is applied in the direction of vacuum evaporation coating, electroluminescent light source, coating, etc., can solve the problems of time-consuming process of forming multiple layers and corrupted evaporating source material for forming films, and achieve efficient stacking and good quality

Inactive Publication Date: 2012-05-17
SAMSUNG DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a method for forming a thin film with multiple layers of different materials in a single process. This is achieved by depositing the materials onto a substrate while moving the evaporating sources together. The method allows for precise control over the deposition regions and can produce a high-quality multilayer film.

Problems solved by technology

Therefore, a process of forming multiple layers may be time-consuming.
However, in this described method, deposition from one evaporation source is performed only after completing deposition from another evaporation source within one chamber.
Thus, the evaporating source material for forming a film may be corrupted in the second evaporating operation due to the residue gases from the first evaporating operation.

Method used

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  • Evaporating method for forming thin film
  • Evaporating method for forming thin film
  • Evaporating method for forming thin film

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Embodiment Construction

[0039]Reference will now be made in detail to the present embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout. The embodiments are described below in order to explain the present invention by referring to the figures.

[0040]FIG. 1 is a sectional view schematically showing an evaporation system performing a method of forming a thin-film, according to an embodiment of the present invention.

[0041]Although a chamber is not shown in FIG. 1 for convenience of explanation, all components shown in FIG. 1 may be disposed in a chamber maintained at an appropriate vacuum level. Alternatively, the chamber may be maintained in an inert atmosphere including inert gases.

[0042]A substrate 10, which is an object to be processed, is disposed within the chamber. The substrate 10 may be a substrate for a flat-panel display device, and more generally, any substrate having a large surfac...

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Abstract

A method of forming a film on a substrate includes depositing first and second evaporating source materials respective from first and second evaporating sources onto the substrate while moving the evaporating sources together with respect to the substrate, the first and second evaporating source materials being different from each other and positioned to provide a non-overlapping deposition region of the first evaporating source material, an overlapping deposition region of the first and second evaporating source materials and a non-overlapping deposition region of the second source material such that when the evaporating sources are moved, a film is formed to include a first layer that is a deposition of only the first evaporating source material, a second layer that is a deposition of a mixture of the first evaporating source material and the second evaporating source material and a third layer that is a deposition of only the second source material.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application is a divisional of U.S. patent application Ser. No. 12 / 206,785, filed Sep. 9, 2008, which claims the benefit of Korean Patent Application No. 2008-22592, filed Mar. 11, 2008, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]Aspects of the present invention relate to a method of forming a thin film, and more particularly, to an evaporating method for forming a thin film, wherein various types of multi-layer films can be formed on an object to be processed.[0004]2. Description of the Related Art[0005]An organic thin film including an emission material layer in a flat-panel display device, such as an organic light emitting display (OLED) device, is typically formed using a thin-film evaporation process in which a material to form the organic thin film is evaporated in vacuum conditions.[0006]Typically, only a...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B05D5/06H10K99/00
CPCC23C14/12H05B33/10C23C14/243C23C14/24H10K71/00H10K2101/80H10K2101/90
Inventor YOON, JI-HWANLEE, KWAN-HEEKWAK, JAE-HYUNKIM, DONG-HUNCHUN, MIN-SEUNGSON, JUNG-HA
Owner SAMSUNG DISPLAY CO LTD