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Symmetrical series fan structure

a fan structure and fan technology, applied in the direction of machines/engines, positive displacement liquid engines, machines/engines, etc., can solve the problems of high heat generation of compact ic chips such as cpu or graphics chips, increasing mold development cost and manufacturing cost, etc., to save mold development cost, reduce manufacturing cost, and save mold development cost

Inactive Publication Date: 2013-01-17
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is a symmetrical series fan structure that can be made with a single mold and assembled to form the structure. This reduces the mold development cost and lowers the manufacturing cost. The fan structure includes multiple frame bodies that can be connected together through fixing members and fixing holes. This allows for a more cost-effective and efficient manufacturing process.

Problems solved by technology

When a personal computer works, the compact IC chip such as CPU or graphics chip will generate high heat.
This leads to increase of mold development cost and manufacturing cost.
1. The mold development cost is increased.
2. The manufacturing cost is increased.

Method used

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Embodiment Construction

[0024]Please refer to FIGS. 2 and 3. FIG. 2 is a perspective exploded view of a first embodiment of the symmetrical series fan structure of the present invention. FIG. 3 is a perspective assembled view of the first embodiment of the symmetrical series fan structure of the present invention. The symmetrical series fan structure 2 includes multiple frame bodies 30. In this embodiment, the symmetrical series fan structure 2 includes two frame bodies 30, which are serially connected and assembled with each other. Each frame body 30 has a first through hole 301, a second through hole 302 and a base 303. The first and second through holes 301, 302 are respectively formed on two sides of the frame body 30. A flow way 304 is formed between the first and second through holes 301, 302. Multiple connection members 3031 extend from a circumference of the base 303 in straight form. The base 303 is positioned in the second through hole 302 and connected to the frame body 30 via the connection mem...

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Abstract

A symmetrical series fan structure includes multiple frame bodies made with single mold. Each frame body has a first through hole, a second through hole and a base having multiple connection members. The base is positioned in the second through hole on one side of the frame body and connected to the frame body via the connection members. The frame body has multiple fixing members and multiple fixing holes on the same side of the frame body as the base. The frame bodies are serially connected by means of inserting the fixing members into the fixing holes with the bases and the connection members of the frame bodies attached to each other. Accordingly, the frame bodies can be made with single mold and assembled to form the symmetrical series fan structure. In this case, the mold development cost is saved and the manufacturing cost is lowered.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates generally to a series fan structure, and more particularly to a series fan structure in a symmetrical form. The frame bodies of the series fan structure can be made with single mold and assembled to form the symmetrical series fan structure. In this case, the mold development cost is saved and the manufacturing cost is lowered.[0003]2. Description of the Related Art[0004]Recently, the internal circuits of the integrated circuit (IC) chip have been laid out more and more compactly. Consequently, the chip generates higher and higher heat. When a personal computer works, the compact IC chip such as CPU or graphics chip will generate high heat. In order to keep the IC chip functioning lastingly, it is necessary to maintain the IC chip at an optimal working temperature. In this case, rise of temperature can be avoided so as not to deteriorate the efficiency of the IC chip or damage the IC chip. ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F01D13/02
CPCF04D25/166F04D25/0613F04D19/007Y10T137/86139
Inventor LIU, WEN-HAO
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD
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