Heat radiation dissipation film structure and method of making the same

Abstract

Disclosed are a heat radiation dissipation film structure and a method of making the same. The heat radiation dissipation film structure includes a substrate which is electrically insulated and a heat radiation dissipation film disposed on the substrate. The difference between the thermal expansion coefficients of the substrate and the heat radiation dissipation film is not greater than 0.1%. The heat radiation dissipation film contains the crystal of at least one metal and nonmetal with a specific microscopic surface structure which is formed by spraying and coating the heated mixture onto the substrate under high pressure. The heat radiation from the heat radiation dissipation film is directed from the interface of the heat radiation dissipation film and the substrate towards the substrate.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention generally relates to a heat radiation dissipation film structure and a method of making the same, and more specifically to a heat radiation dissipation film structure including a heat radiation dissipation film for enhancing the cooling effect through heat radiation.[0003]2. The Prior Arts[0004]In general, mechanic devices or electric appliances may deteriorate or even fail to work due to overheating. Additionally, the lifetime is thus reduced. Consequently, various heat dissipation devices or mechanisms are needed to prevent the temperature of the working device from exceeding the allowable temperature.[0005]For example, internal combustion engine is operated by the explosion force generated by igniting the high pressured gasoline or Diesel oil within a closed chamber. A vehicle is driven to move by the mechanic power output from the internal combustion engine through a gear chain or a driving mec...

AI Technical Summary

Benefits of technology

The present invention provides a heat radiation dissipation film structure with a high level of heat dissipation. This is achieved by using a substrate that is electrically insulated and a heat radiation dissipation film that is disposed on the substrate. The difference between the thermal expansion coefficients of the substrate and the heat radiation dissipation film is not greater than 0.1. The invention also provides a method of manufacturing the heat radiation dissipation film structure, which involves preparing a mixture of metal and nonmetal compounds, spraying and coating it onto a heated substrate, and cooling it to form the heat radiation dissipation film structure.

Problems solved by technology

In general, mechanic devices or electric appliances may deteriorate or even fail to work due to overheating.

The internal temperature of the working engine is extremely high and the engine may easily overheat and hence the engine does not work normally without certain appropriate heat dissipation mechanism.

In the worst condition, the engine may explode.

In particular, the LED has been widely used recently such that the problem of heat dissipation for the LED becomes more critical.

As a result, it is needed to increase the surface area of the heat dissipation device and the cost is increased such that the final product is too heavy and it is inconvenient to use.

Besides, as the LED with 2 W attains up to 135° C., the additional heat dissipation device may help the LED reduce to only 125° C. or 115° C., and it is still too high.

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