Unlock instant, AI-driven research and patent intelligence for your innovation.

PCB with visible circuit and method for making and using PCB with visible circuit

a technology of visible circuit and pcb, which is applied in the direction of circuit optical details, dielectric characteristics, lamination of printed circuit boards, etc., can solve the problem of degrading the visibility of pcb with visible circui

Inactive Publication Date: 2014-06-05
AVARY HLDG (SHENZHEN) CO LTD +1
View PDF2 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent proposes a PCB with visible circuits that can be seen from outside. The PCB is made using a clear / transparent material as a substrate and a cover film. The PCB is adhered to electronic modules using a thick and less transparent UV adhesive. The technical effect is that the PCB with visible circuits is visible and can be easily identified.

Problems solved by technology

In addition, to ensure sufficient adhesive strength, the UV adhesive is often thick and thus further degrades a visibility of the PCB with visible circuit.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • PCB with visible circuit and method for making and using PCB with visible circuit
  • PCB with visible circuit and method for making and using PCB with visible circuit
  • PCB with visible circuit and method for making and using PCB with visible circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011]Embodiments of the present disclosure will be described with reference to the drawings.

[0012]FIG. 1 shows a PCB with visible circuit 100, according to an embodiment. The circuited substrate 100 includes a circuited substrate 110, a first optical clear adhesive (OCA) layer 130, a second OCA layer 140, a first release film 150, and a second release film 160.

[0013]The circuited substrate 110 includes a clear substrate 111, a first adhesive layer 112, a circuit layer 113, and a cover film 120. The circuit layer 113 is adhered to the clear substrate 111 using the first adhesive layer 112. The cover film 120 is pressed onto and is adhered onto the circuit layer 113, opposite to the first adhesive layer 112.

[0014]The clear substrate 111 can be made of polyethylene terephthalate (PET) and has excellent optical properties (i.e., transparency) and weather resistance.

[0015]The first adhesive layer 112 can be made of OCA and has excellent optical properties (i.e., transparency).

[0016]The ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Fractionaaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

A printed circuit board (PCB) with visible circuit includes a circuited substrate, a first and second release films, and a first and second optical clear adhesive (OCA) layers. The first and second release films are pressed onto and are adhered to two opposite surfaces of the circuited substrate via the first and second OCA layers respectively, and the first and second OCA layers are made of polymethyl methacrylate (PMMA).

Description

BACKGROUND[0001]1. Technical Field[0002]The present disclosure relates to printed circuit boards (PCBs) and, particularly to a PCB with visible circuit (i.e., clear / transparent PCB) and a method for making and using the PCB with visible circuit.[0003]2. Description of Related Art[0004]At present, PCBs are widely used. See Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 1418-1425.[0005]To meet certain requirements, a PCB with visible circuit is proposed, in which clear / transparent material is employed as a substrate and a cover film of the PCB with visible circuit, and, as such, circuits of the PCB with visible circuit sandwiched between the substrate and the cover film can be seen from outside. In use, the PCB with visible circuit is adhered to electronic modules using ultraviolet (UV) curable adhesive, which has...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/02H05K3/00
CPCH05K3/00H05K1/0274H05K3/0058H05K2201/0108
Inventor HO, MING-JAANHU, XIAN-QIN
Owner AVARY HLDG (SHENZHEN) CO LTD