Method of manufacturing substrate having cavity

Abstract

The method of manufacturing a substrate includes: forming a penetrating hole in a base layer; inserting a metal dummy part in the penetrating hole; forming an insulating portion made of synthetic resin to fill a ring-shaped gap between the penetrating hole and the dummy part; forming lower insulating layers, covering the bottom surface of the dummy part, that are made of synthetic resin on the bottom surface of the base layer to be continuous with the insulating portion; forming upper insulating layers, covering the top surface of the dummy part, that are made of synthetic resin on the top surface of the base layer to be continuous with the insulating portion; forming an exposing hole by routing in the upper insulating layers to expose the top surface of the dummy part; and forming a cavity by removing the dummy part exposed through the exposing hole by etching.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a method of manufacturing a substrate having a cavity (recess) for installing an electronic component therein.[0003]2. Description of Related Art[0004]With mobile devices such as mobile phones and smartphones having a smaller profile, there is strong demand for reducing the thickness of the substrate having an electronic component installed therein, and one method of realizing reduced thickness is to provide a cavity (recess) (refer to Patent Document 1 below, for example). That is, by installing an electronic component inside the cavity, it is possible to reduce the thickness of the substrate having installed therein the electronic component.[0005]Examples of methods to provide the substrate with a cavity include: (M1) forming a cavity by mechanical cutting; (M2) forming a cavity by chemical etching; and (M3) forming a cavity by stacking a plurality of layers having penetrating holes al...

AI Technical Summary

Benefits of technology

[0010]An object of the present invention is to provide a method of manufacturing a substrate having a cavity that is not susceptible

Problems solved by technology

However, if the cavity is formed such that the thickness below the bottom surface is very thin (100 μm or less, for example) then there is a risk that stress resulting from cutting will result in damage such as cracking in the bottom surface.

Also, cutting involves a dimensional tolerance of at least ±tens of μm, and thus, there is a tendency for variation to occur in the cross-sectional dimensions and depth of the cavity, and it is difficult to create a cavity with smooth inner walls and bottom surface.

However, if the material to be etched is synthetic resin, the time taken to etch is generally longer than if the material were metal.

Also, the etchant used for the synthetic resin generally depends on the type of synthetic resin, but this method is unrealistic due to some types

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