Retainer ring structure for chemical-mechanical polishing machine and method for manufacturing the same

Abstract

A retainer ring structure for a chemical-mechanical polishing (CMP) machine includes: an insert ring made of metal and having a plurality of holes formed at the top surface thereof and coupled to a head of the CMP machine; an insert pin made of resin, including a body having a hollow portion of which the top surface is opened and one or more elongated grooves formed at side surfaces thereof in a longitudinal direction, and press-fitted into a hole of the insert ring so as to be subjected to a tapping process; and an outer ring formed to surround the insert pin and the insert ring.

Description

BACKGROUND OF THE INVENTION[0001]The present invention relates to a retainer ring structure for a chemical-mechanical polishing (CMP) machine, and more particularly, to a retainer ring structure for a CMP machine and a method for manufacturing the same, which prevents external exposure of a metallic ring of a retainer ring structure to fix the position of a silicon wafer during a CMP process, thereby preventing contamination and corrosion of the metallic ring and improving durability, and uses a low-priced metallic material to reduce the manufacturing cost, thereby increasing marketability.[0002]With the increase in operating speed and integration degree of semiconductor devices, the increase in number of interconnection layers and the miniaturization of interconnection patterns in a multilayer interconnection structure have been required more and more. The multilayer interconnection technology is an important issue for a sub-micron process.[0003]In particular, as a process margin f...

AI Technical Summary

Benefits of technology

[0009]An embodiment of the present invention is directed to a retainer ring structure for a CMP machine and a method for manufacturing the same, which prevents external exposure of a metallic ring of a retainer ring structure, thereby preventing contamination and corrosion of the metallic ring and improving durability, and uses a low-priced metallic material to reduce the manufacturing cost, thereby increasing marketability.

Problems solved by technology

The multilayer interconnection technology is an important issue for a sub-micron process.

Since the retainer ring is made of resin such as plastic, the retainer ring has a low strength.

Furthermore, a lot of time is required for a planarization process of the ring before the CMP process, and partial abrasion may occur due to the imbalance of force when a cover bolt is tightened.

In this case, however, there are difficulties in coupling the metallic ring and the resin ring, and thus workability inevitably decreases.

During the coupling operation, boding or welding may be used, but partial abrasion may occur due to the incomplete function and non-uniform coupling.

Furthermore, as bolt holes formed in the metallic ring are exposed to the outside, contamination may occur due to a polishing agent, and corrosion may easily occur to reduce the durability.

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