MEMS package structure

Abstract

A MEMS package structure including a chip, a MEMS device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface. The MEMS system device is disposed on the active surface. The lid is covered on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is sealed around the chip, the sealant and the lid.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention generally relates to a chip package structure. More particularly, the present invention relates to a microelectromechanical system (MEMS) package structure.[0003]2. Description of Related Art[0004]Microelectromechanical system (MEMS) is a microelectromechanical device fabricated in a microminiaturized package structure, and the fabricating technique thereof is quite similar to the technique of fabricating integrated circuits (ICs). However, interactions, for example, about mechanics, optics, or magnetic force between the MEMS device and surrounding environment are more than that of the conventional IC.[0005]The MEMS device may include micro-sized electromechanical components (for example, switches, mirrors, capacitors, accelerometers, sensors, capacitive sensors, or actuators etc.), and the MEMS device may be integrated with the IC in a manner of single block, thereby greatly modifying insertion lo...

AI Technical Summary

Benefits of technology

[0019]Based on the above-mentioned description, the MEMS package structure of the present invention applies the lid having the recess for accommodating the MEMS device so as to reduce the height of the peripheral gap between the chip and the lid, the sealant disposed between the peripheral gap seals the recess, so that the MEMS package structure of the present invention provides better moisture resistance property. In addition, the first moisture barrier coated around the chip, the lid and the sealant provides a double protection to prevent the moisture from permeating to the recess. Besides, the second moisture barrier provides a third protection to seal the chip, the MEMS device, the lid, the sealant and the first moisture barrier in the cavity enclosed by the first substrate and the second substrate. Moreover, the molding compound disposed in the cavity is glued around the first moisture barrier to provide a fourth protection. Furthermore, the moisture absorption element disposed in the cavity provides a fifth protection to absorb the moisture in the cavity.

Problems solved by technology

However, in the macroscopic world of the entire package structure, the MEMS device is extremely fragile and may be impacted by slight static electricity or surface tension at any moment to cause failure.

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