Compound heat-dissipating device

a heat dissipating device and compound technology, applied in semiconductor devices, solid-state devices, heat exhanger fins, etc., can solve the problems of not being able to combine in a firm way, and achieve the effect of enhancing heat dissipation efficiency and combining area and conductive area

Inactive Publication Date: 2015-11-26
THERMAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent is about a new invention that helps to improve the heat-dissipating efficiency of a device. The invention involves combining a conductive base with a heat-dissipating body, which increases the combining area and conductive area, resulting in better heat-dissipating performance.

Problems solved by technology

However, this kind of combining way is still not so firm.

Method used

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  • Compound heat-dissipating device
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  • Compound heat-dissipating device

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first embodiment

[0020]Please refer to FIGS. 1 and 2, which are perspective exploded views of a compound heat-dissipating device according to the instant disclosure. The instant disclosure provides a compound heat-dissipating device 100, which includes a conductive base 10 and a heat-dissipating body 20. The conductive base 10 is embedded with a bottom of the heat-dissipating body 20. For a preferable embodiment of material arrangement, the conductive base 10 can be made of copper, and the heat-dissipating body 20 can be made of aluminum. Such arrangement utilizes copper which has higher heat-conductive coefficient for conducting with a surface of the heat-generating device and transferring to the heat-dissipating body 20 to dissipate heat. The copper material of conductive base could be copper or copper alloy. However, the instant disclosure is not limited thereto, it can be an assembly of different metals such as aluminum, copper, steel, or alloy thereof. Further, the manufacturing method can be M...

second embodiment

[0028]Refer to FIGS. 5 and 6, which are perspective exploded views of a compound heat-dissipating device according to a second embodiment of the instant disclosure. In this embodiment, the difference between this compound heat-dissipating device 100′ and the above embodiment is that, the conductive base 10′ has a plurality of different-shaped combining portions 16, the combining portions 16 are T-shaped in cross-sectional view. Each combining portion 16 has a top end which is rectangular-shaped, and has a level portion 161 and a neck portion 162 extended from the level portion 161 to the first top surface 12 of the conductive base 10. The heat-dissipating body 20′ is formed with a plurality of combining grooves 216 corresponding with the combining portions 16 of the concave portion 210. Such T-shaped structure can prevent a split between the heat-dissipating body 20′ and the conductive base 10′. The distribution of the combining portions 16 is similar to the first embodiment.

[0029]R...

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Abstract

A compound heat-dissipating device includes a conductive base and a heat-dissipating body. The conductive base has a first bottom surface, a first top surface, and a plurality of combining portions protruded from the first top surface. Each combining portion has a bottom end connected with the first bottom surface and a top end extended from the bottom end integrally. The top end has a cross-sectional area bigger than that of the bottom end. The heat-dissipating body has a second bottom surface and a second top surface. The second bottom surface has a pair of concave portions corresponding to a contour of the conductive base, and a plurality of combining grooves formed in the concave portion. The shape of the combining grooves is corresponding to that of the combining portions, and the combining portions are correspondingly combined with the combining grooves.

Description

BACKGROUND OF THE INSTANT DISCLOSURE[0001]1. Field of the Instant Disclosure[0002]The instant disclosure relates to a heat-dissipating device for dissipating heat from a heat-generating device, particularly to a compound heat-dissipating device combining two different metallic elements for enhancing the heat-conductive effectiveness.[0003]2. Description of Related Art[0004]In order to release the heat generated by the heat-generating electronic devices, such as a central processing unit (CPU) or a chip, a heat-dissipating device is generally used to achieve the object. Further, to improve heat-conductive effect of a contacting part of heat-dissipating device which is contacted with the heat-generating device, a conventional heat-dissipating structure compounded of two metallic materials is developed.[0005]The conventional heat-dissipating structure usually has a heat-dissipating unit made of aluminum and a heat-conductive base made of copper, and both have a contacting surface combi...

Claims

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Application Information

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IPC IPC(8): F28F21/08F28F13/00
CPCF28F21/084F28F13/00F28F2215/00F28F2013/005F28F21/085F28F3/022H01L23/3677H01L23/3735F28F2275/14H01L2924/0002H01L23/3736H01L2924/00
InventorCHEN, RU-LOONG RAYMONDCHAN, CHUN-HOUWU, CHUN-LUNG
OwnerTHERMAL TECH