Fan-out wafer level package

Abstract

A fan-out wafer level package is provided. The fan-out wafer level package includes a semiconductor element, a molding compound, a first fan-out structure, a conductive heat spreader, and a plurality of solder balls. The semiconductor element includes a plurality of bonding pads. The molding compound covers the semiconductor element. The first fan-out structure is formed on the semiconductor element, wherein the first fan-out structure has a plurality of fan-out contacts electrically connected to the bonding pads. The conductive heat spreader is formed on the first fan-out structure, wherein the conductive heat spreader has a plurality of through holes filled with a conductive material. The solder balls are formed on the conductive heat spreader, wherein the solder balls are electrically connected to the first fan-out structure via the through holes filled with the conductive material.

Description

[0001]This application claims the benefit of People's Republic of China Application Serial No. 201410430514.0, filed Aug. 28, 2014, the subject matter of which is incorporated herein by reference.BACKGROUND[0002]1. Technical Field[0003]The disclosure relates in general to a fan-out wafer level package, and more particularly to a fan-out wafer level package having excellent heat dissipation effects.[0004]2. Description of the Related Art[0005]Recently, fan-out wafer level packages (FOWLP) have been popularly applied in making semiconductor chips due to the high performance and low cost requirements provided therefrom. For example, 28 nm node wafers have utilized FOWLP technology as a solution for mobile products.[0006]However, there are still some issues, such as heat dissipation and structural delamination; therefore, there is always a continuing need to provide an improved FOWLP with reliable performances.SUMMARY OF THE INVENTION[0007]The disclosure is directed to a fan-out wafer l...

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