Circuit board element

Abstract

A circuit board element includes a glass substrate, a first dielectric layer, and a first patterned metal layer. The glass substrate has an edge. The first dielectric layer is disposed on the glass substrate and has a central region and an edge region. The edge region is in contact with the edge of the glass substrate, and the thickness of the central region is greater than the thickness of the edge region. The first patterned metal layer is disposed on the glass substrate and in the central region of the first dielectric layer.

Description

RELATED APPLICATIONS[0001]This application claims priority to Taiwanese Application Serial Number 105121258, filed Jul. 5, 2016, which are herein incorporated by reference.BACKGROUNDTechnical Field[0002]The present disclosure relates to a circuit board element.Description of Related Art[0003]With the rapid growth of the electronics industry, the R & D of electronic products has gradually been directed to the pursuit of versatility and high performance. In order to achieve the requirements of high integration and miniaturization of semiconductor components, the requirements of circuit boards also increase. For example, the line width and pitch of a circuit board is required to become smaller and smaller, and the thickness of the circuit board is required to become smaller and smaller. As these requirements of circuit boards continue, some unexpected problems may arise.[0004]To further improve the circuit boards, persons in the industry have made every endeavor to discover new solutio...

AI Technical Summary

Benefits of technology

[0005]This disclosure provides a method for manufacturing a circuit redistribution structure to enhance the structure stability and the wiring density of the circuit redistribution structure and reduce the thickness and the manufacturing cost of the circuit redistribution structure.

[0017]In the aforementioned embodiments, the thickness of the edge region of the first dielectric layer and the edge region of the second dielectric layer is smaller, so the thermal stress applied to the edge of the glass substrate by the first dielectric layer and the second dielectric layer will be smaller, such that the small defects will not be affected by the thermal stress and the glass substrate will not be broken. Therefore, the circuit board element can pass the reliability test.

Problems solved by technology

As these requirements of circuit boards continue, some unexpected problems may arise.

Since there may be small defects on the edges of the glass substrate due to the cutting process, the thermal stress applied to the glass substrate by the dielectric layer may break the glass substrate, such that the circuit board element may be damaged.

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