Non-volatile memory

a non-volatile memory and memory technology, applied in the field of semiconductor devices, can solve the problems of reducing the reliability of the memory device, affecting the electrical performance of the memory cell, etc., and achieve the effect of facilitating the reliability of the semiconductor devi

Active Publication Date: 2020-05-14
IOTMEMORY TECH
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008]The invention provides a non-volatile memory and a manufacturing method thereof capable of being operated at a low operational voltage, so as to facilitate the reliability of the semiconductor device.
[0009]The invention provides a non-volatile memory and a manufacturing method thereof capable of reducing the gate resistance, so as to facilitate the operational speed of the semiconductor device.
[0010]The invention provides a non-volatile memory and a manufacturing method thereof capable of increasing the level of integration of the device.

Problems solved by technology

Thus, an abnormal punch through between the drain and the source may occur easily, which greatly affects the electrical performance of the memory cell.
In addition, the electrons repetitively passing through the tunneling oxide layer during programming or erasing of memory cells may wear off the tunneling oxide layer and thus reduce the reliability of the memory device.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Non-volatile memory
  • Non-volatile memory
  • Non-volatile memory

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0053]Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.

[0054]FIG. 1A is a top view illustrating a non-volatile memory according to an embodiment of the invention. FIG. 1B is a schematic cross-sectional view illustrating a non-volatile memory according to an embodiment of the invention. FIG. 1B is a cross-sectional view taken along a line A-A′ as shown in FIG. 1A. FIG. 1C is a schematic cross-sectional view illustrating a non-volatile memory according to an embodiment of the invention. FIG. 1D is a top view illustrating a non-volatile memory according to an embodiment of the invention. FIG. 1E is a schematic cross-sectional view illustrating a non-volatile memory according to an embodiment of the invention. FIG. 1E is a cross-sectional view taken along a ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A non-volatile memory having memory cells is provided. The memory cell includes a source region and a drain region, a select gate, a dummy select gate, a floating gate, an erase gate, and a control gate. The select gate is disposed on the substrate between the source region and the drain region. The floating gate is disposed on the substrate between the select gate and the source region, and a top portion of the floating gate has corners in symmetry. The height of the floating gate is lower than the height of the select gate. The erase gate is provided on the source region and covers the corner at the side of the source. The control gate is disposed on the erase gate and the floating gate.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefit of Taiwan application serial no. 107139903, filed on Nov. 9, 2018. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.BACKGROUND OF THE INVENTIONField of the Invention[0002]The invention relates to a semiconductor device and a manufacturing method thereof. More particularly, the invention relates to a non-volatile memory and a manufacturing method thereof.Description of Related Art[0003]A non-volatile memory allows multiple data writing, reading and erasing operations, and the stored data is retained even after power is cut off. With these characteristics, non-volatile memories have been widely used in personal computers and electronic equipment.[0004]The typical design of a non-volatile memory includes a stack-gate structure, and the stack-gate structure includes a tunneling oxide layer, a floating gate, an int...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(United States)
IPC IPC(8): H01L27/11519H01L29/788H01L29/78H01L29/51H01L29/423H01L29/06H01L29/49H01L21/28
CPCH01L29/42328H01L29/517H01L29/4933H01L29/788H01L29/0696H01L29/40114H01L27/11519H01L29/7851H01L29/42324H01L29/42356H01L29/66825H01L29/401H10B41/30H01L29/785H10B41/10
Inventor FAN, DER-TSYRHUANG, I-HSINCHENG, YU-MING
Owner IOTMEMORY TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products