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Multilayer substrate

a multi-layer substrate and substrate technology, applied in the direction of waveguides, waveguide type devices, circuit bendability/stretchability, etc., can solve the problems of changing the coupling state between the lines and unable to obtain desired characteristics, and achieve the effect of reducing or preventing a significant characteristic change, reducing or preventing a characteristic change in a bent state, and being convenient to bend

Pending Publication Date: 2021-09-02
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent presents a solution for reducing or preventing changes in the characteristics of a flexible substrate when it is bent. The invention allows for the use of a multilayer substrate with specific features that help to maintain the user's desired performance, even when the substrate is bent. This results in a more robust and reliable flexible substrate that can be used in a variety of applications.

Problems solved by technology

However, in a case in which the transmission line including a plurality of signal lines as disclosed in International Publication No. 2016 / 163436 is bent in the stacking direction, a coupled state between the lines is changed, and desired characteristics may not be obtained.

Method used

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first preferred embodiment

[0022]A multilayer substrate according to a first preferred embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of a multilayer substrate 10 according to the first preferred embodiment of the present invention. FIG. 2 is an exploded plan view of the multilayer substrate 10 according to the first preferred embodiment of the present invention. FIG. 3A is a cross-sectional view in a first region of the multilayer substrate 10 according to the first preferred embodiment of the present invention, and FIG. 3B is a cross-sectional view in a second region of the multilayer substrate 10 according to the first preferred embodiment of the present invention. FIG. 4 is a side cross-sectional view of the multilayer substrate 10 according to the first preferred embodiment of the present invention. In each of the drawings in the following preferred embodiments, the vertical and horizontal dimensional relationship is emphasized...

second preferred embodiment

[0046]A multilayer substrate according to a second preferred embodiment of the present invention will be described with reference to the drawings. FIG. 5 is an exploded plan view of a multilayer substrate 10A according to the second preferred embodiment of the present invention. FIG. 6 is a side cross-sectional view of the multilayer substrate 10A according to the second preferred embodiment of the present invention. In FIG. 5, wiring in a stacking direction (the Z-axis direction) is substantially the same at both ends.

[0047]As shown in FIG. 5 and FIG. 6, the multilayer substrate 10A according to the second preferred embodiment of the present invention is different from the multilayer substrate 10 according to the first preferred embodiment of the present invention in the shape of a first signal line 310A, the shape of a second signal line 320A, the structure of the first signal line 310A and the second signal line 320A that face each other in the Z-axis direction, the inclusion of ...

third preferred embodiment

[0061]A multilayer substrate according to a third preferred embodiment of the present invention will be described with reference to the drawings. FIG. 7 is an exploded plan view of a multilayer substrate 10B according to the third preferred embodiment of the present invention. FIG. 8 is a side cross-sectional view showing a state in which the multilayer substrate 10B according to the third preferred embodiment of the present invention is connected to a connector 500B. In FIG. 7, the wiring in the stacking direction (the Z-axis direction) is the same or substantially the same at both ends.

[0062]As shown in FIG. 7 and FIG. 8, the multilayer substrate 10B according to the third preferred embodiment is different from the multilayer substrate 10A according to the second preferred embodiment in the inclusion of a fifth layer L5 and a sixth layer L6, the shapes of a first signal line 310B and a second signal line 320B, and the inclusion of a terminal electrode 211B and a terminal electrode...

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Abstract

A multilayer substrate includes an insulator that includes a first region and a second region that is thinner than the first region, and a first signal line and a second signal line that are structured to extend across the first region and the second region. In a region in which the first signal line and the second signal line face each other, a line width of the first signal line and a line width of the second signal line are smaller in the second region than in the first region, and a distance between the first signal line and the second signal line is smaller in the second region than in the first region.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit of priority to Japanese Patent Application No. 2018-235085 filed on Dec. 17, 2018 and is a Continuation Application of PCT Application No. PCT / JP2019 / 048859 filed on Dec. 13, 2019. The entire contents of each application are hereby incorporated herein by reference.BACKGROUND OF THE INVENTION1. Field of the Invention[0002]The present invention relates to a multilayer substrate including a differential line.2. Description of the Related Art[0003]Conventionally, various types of transmission lines that transmit a high frequency signal have been devised. For example, a transmission line disclosed in International Publication No. 2016 / 163436 is provided by stacking a plurality of insulator layers on each other. In a direction (a stacking direction) in which the insulator layers are stacked on each other, the thickness of the transmission line is uniform.[0004]However, in a case in which the transmission line...

Claims

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Application Information

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IPC IPC(8): H05K1/02
CPCH05K1/0298H01P3/00H05K1/0284H01P3/04H01P3/026H01P3/08H01P5/028H05K1/0278H05K1/025H05K1/0245H05K3/4691
Inventor NAGAI, TOMOHIRO
Owner MURATA MFG CO LTD