Mask glue removing apparatus, system and method

Pending Publication Date: 2021-11-25
SK HYNIX INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0006]Various embodiments are provided for an improved mask glue removing a

Problems solved by technology

However, as time elapses or when certain semiconductor manufacturing processes are performed, the glue is cured which makes removal of the glue more difficult.
However, the

Method used

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  • Mask glue removing apparatus, system and method
  • Mask glue removing apparatus, system and method
  • Mask glue removing apparatus, system and method

Examples

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Example

[0028]Various embodiments of the present disclosure are described in detail with reference to the accompanying drawings. The drawings are schematic illustrations of various embodiments and intermediate structures. As such, variations from the configurations and shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, the described embodiments should not be construed as being limited to the particular configurations and shapes illustrated herein but may include deviations in configurations and shapes which do not depart from the spirit and scope of the present disclosure as defined in the appended claims.

[0029]The present disclosure is described herein with reference to cross-section and / or plan illustrations of idealized embodiments of the present disclosure. However, embodiments of the present disclosure should not be construed as limiting the present disclosure. Although a few embodiments of the present disclosu...

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Abstract

A mask glue removing apparatus includes a first plate including a plurality of nozzles to be adjusted at independent dispensing angles of each other and a head in which the plurality of nozzles are installed and configured to move the head close to a position corresponding to a region of a mask in which glue is present, adjust the dispensing angles of the plurality of nozzles to face the region in which the glue is present, and dispense a chemical liquid, rinse, or air through the plurality of nozzles to remove the glue, and a second plate on which the mask is placed and configured to adjust a position of a main body according to a removal process for the glue.

Description

CROSS-REFERENCES TO RELATED APPLICATION[0001]The present application claims priority under 35 U.S.C. § 119(a) to Korean Patent Application Number 10-2020-0060959, filed on May 21, 2020, which is incorporated herein by reference in its entirety.BACKGROUND1. Technical Field[0002]Various embodiments generally relate to a semiconductor device and, more particularly, to a mask glue removing apparatus, system and method.2. Related Art[0003]A transparent thin film pellicle may be attached to a surface of an exposure mask using glue in order to protect the surface of the exposure mask from molecules in the air or other types of contamination sources. However, as time elapses or when certain semiconductor manufacturing processes are performed, the glue is cured which makes removal of the glue more difficult.[0004]In recent years, to remove the cured glue, a liquid chemical cleaning process is performed on a region of the mask in which mask patterns are formed as well as on a region of the ma...

Claims

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Application Information

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IPC IPC(8): B08B3/02B08B5/02G03F1/82
CPCB08B3/02B08B5/02B08B2203/02B08B2220/01G03F1/82G03F1/64G03F1/62G03F7/70983B05B1/14
Inventor KIMKIM, SEOK JOONAM, KYUNG HYUNSHIN, JIN SICKCHAE, HOONCHOI, JUNG JIN
Owner SK HYNIX INC
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