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Protection layers for media protection during fabrication of probe memory device

a technology of memory device and protection layer, which is applied in the field of protecting the media film of the mems probe memory device, can solve the problems of significant damage to the media film

Inactive Publication Date: 2011-09-13
INTEL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention relates to a method for protecting the media film of a MEMS probe memory device during fabrication processes. The invention addresses the issue of damage to the media film caused by mechanical abrasion, chemical exposure, thermal treatment, and other steps involved in the fabrication process. The invention proposes adding a protective layer over the media layer to prevent damage and facilitate the fabrication process. The protective layer can be easily removed once the fabrication process is completed. The technical effect of the invention is to provide a reliable and efficient method for protecting the media film of a MEMS probe memory device during fabrication.

Problems solved by technology

These steps can cause significant damage to the media film by mechanical abrasion, chemical exposure, thermal treatment, etc.

Method used

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  • Protection layers for media protection during fabrication of probe memory device
  • Protection layers for media protection during fabrication of probe memory device
  • Protection layers for media protection during fabrication of probe memory device

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Embodiment Construction

[0012]Reference throughout this specification to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0013]FIGS. 1A-1C illustrate tracking in a common SSP memory configuration. FIG. 1A illustrates an SSP memory configuration in which a cantilever probe is anchored to a substrate (the cantilever wafer), and can be actuated to contact or de-contact the storage media on a mover that carries a storage media and is positioned over the cantilever wafer. The data tracks are stored in the storage media in one of two ways, de...

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Abstract

A micro-electro-mechanical system (MEMS) seek-scan probe (SSP) memory device utilizes a protective layer over the delicate media layer to protect the media during harsh processing steps that may otherwise damage the media layer. The protective layer may comprise a layer of germanium and a layer of silicon dioxide.

Description

FIELD OF THE INVENTION[0001]Embodiments of the present invention are directed to micro-electro-mechanical system (MEMS) fabrication and, more particularly, to a protecting the media film of a MEMS probe memory device during the fabrication process.BACKGROUND INFORMATION[0002]Seek-scan probe (SSP) memories are a type of memory that uses non-volatile storage media as the data storage mechanism and offers significant advantages in both cost and performance over conventional charge-storage memories. Typical SSP memories include storage media made of materials that can be electrically switched between two or more states having different electrical characteristics such as resistance, polarization dipole direction, or some other characteristic.[0003]SSP memories are written to by passing an electric current through the storage media or applying an electric field to the storage media. Passing a current through the storage media, or applying an electric field to the media, is typically accom...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): G11B9/00
CPCG11B9/1436G11B9/149G11B9/02G11C23/00
Inventor HECK, JOHN
Owner INTEL CORP