Fabrication process for a flexible, thin thermal spreader
a technology of thermal spreader and fabrication process, which is applied in the direction of indirect heat exchangers, basic electric elements, light and heating apparatus, etc., can solve the problems that the current fabrication process of thermal spreaders may not provide a thermal spreader having a desired level of performance/desired performance characteristics
Active Publication Date: 2012-06-26
ROCKWELL COLLINS INC
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AI Technical Summary
Benefits of technology
The solution provides a thermally efficient, mechanically flexible thermal spreader that effectively manages heat from electronics components, reducing thermal resistance and maintaining long-term protection against corrosion, while being cost-effective and lightweight.
Problems solved by technology
Current fabrication processes for thermal spreaders may not provide a thermal spreader having a desired level of performance / desired performance characteristics.
Method used
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[0050]Reference will now be made in detail to the presently preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings.
[0051]A thermal spreader / heat spreader may be used to diffuse and transport thermal energy from a heat source, such as an electronics component on a circuit board, to a lower temperature surface, such as a chassis in which the circuit board may be mounted. A heat spreader may be constructed of a material having a high thermal conductivity, such as metal (ex.—copper, aluminum), in order to reduce thermal gradients within the heat spreader so that the heat spreader may minimize the temperature of the heat source. When thermal gradients within a heat spreader are excessive, inserts (ex.—heat pipes, pyrolytic graphite inserts) having high effective thermal conductivities may be integrated with / into the heat spreader to offer / provide improved thermal paths.
[0052]Because of their structural properties, metal heat spreaders may b...
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Abstract
The present invention is a method for fabricating a thermal spreader. The method may include laminating a plurality of layer portions together to fabricate a mechanically flexible substrate. The method may further include providing an internal channel within the mechanically flexible substrate, the internal channel configured for containing an electrically-conductive liquid, the internal channel being further configured to allow for closed-loop flow of the electrically-conductive liquid within the internal channel. The method may further include integrating a pump with the mechanically flexible substrate. The method may further include fabricating a plurality of rigid metal inserts. The method may further include forming a plurality of extension portions on a surface of each rigid metal insert included in the plurality of rigid metal inserts. The method may further include connecting the plurality of rigid metal inserts to the mechanically flexible substrate.
Description
CROSS-REFERENCE[0001]The following patent applications are incorporated by reference in their entireties:[0002]Express Mail No.Filing DateSer. No.EM 210498665 USSep. 12, 200812 / 283,501EM 210498682 USSep. 12, 200812 / 283,504EM 210498696 USSep. 12, 200812 / 283,502Further, U.S. patent application Ser. No. 12 / 116,126 entitled: System and Method for a Substrate with Internal Pumped Liquid Metal for Thermal Spreading and Cooling, filed May 6, 2008, (pending); U.S. patent application Ser. No. 11 / 508,782 entitled: Integrated Circuit Protection and Ruggedization Coatings and Methods filed Aug. 23, 2006, (pending); and U.S. patent application Ser. No. 11 / 732,982 entitled: A Method For Providing Near-Hermetically Coated Integrated Circuit Assemblies filed Apr. 5, 2006 (pending) are also hereby incorporated by reference in their entirety herein.FIELD OF THE INVENTION[0003]The present invention relates to the field of thermal management and particularly to a fabrication process for a flexible, thi...
Claims
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IPC IPC(8): H05K7/20
CPCH01L23/36H01L23/473Y10T29/49368H01L2224/16H01L2224/73253H01L2924/01078H01L2924/01079H01L2924/09701H01L2924/16195H01L2924/3011H01L2924/01019H01L2924/01322H01L2224/16225Y10T29/49369Y10T29/49366H01L23/373H01L2924/00014H01L2924/00011H01L2224/0401H05K7/20
Inventor LOWER, NATHAN P.WILCOXON, ROSS K.WOOLDRIDGE, JAMES R.DLOUHY, DAVID W.
Owner ROCKWELL COLLINS INC