Production apparatus for manufacturing sensor package structure

Abstract

A sensor package structure includes a sensing die, a light-filtering sheet, and an annular pressure-sensitive adhesive sheet. An active surface of the sensing die has a sensing region and a connecting region around the sensing region. The periphery contour of sensing die is greater than or equal to the periphery contour of light-filtering sheet. The pressure-sensitive adhesive sheet has two opposite adhesive surfaces and defines an opening. The adhesive surfaces respectively adhere to the connecting region of the sensing die and the inner surface of the light-filtering sheet, and the sensing region faces the inner surface of the light-filtering sheet via the opening. The sensing region is sealed by the pressure-sensitive adhesive sheet and the light-filtering sheet. Thus, the instant disclosure provides the sensor package structure with low cost, high capacity, and high yield. Moreover, the instant disclosure provides a production apparatus for manufacturing the sensor package structure.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The instant disclosure relates to a package structure; more particularly, to a production apparatus for manufacturing a sensor package structure.[0003]2. Description of Related Art[0004]The conventional compact camera module (CCM) is almost produced by the chip scale package (CSP) process or the chip on board (COB) process. When the package structure is formed by the CSP process, a glass and a die are fixed to each other via an adhesive (e.g., epoxy resin or silicone). Specifically, after dripping the adhesive (e.g., epoxy resin or silicone) in-between the glass and the die, the adhesive needs a lot of time to solidify by baking. Thus, the die fixed on the glass by the CSP process needs to spend too much time to reduce the capacity of the package structure.[0005]Moreover, the dripping step of the package structure is implemented by utilizing the dripping machine, and then combining the glass and the die with each other ...

AI Technical Summary

Benefits of technology

[0008]One embodiment of the instant disclosure provides a sensor package structure and a production apparatus for manufacturing the sensor package structure, thereby reducing the cost of the sensor package structure and increasing the capacity and yield of the sensor package structure.

[0011]In summary, the sensor package structure utilizes the pressure-sensitive adhesive sheet to adhere to the sensing die and the light-filtering sheet for increasing the capacity of the sensor package structure. Moreover, the pressure-sensitive adhesive sheet is solid and has the constant thickness and shape, such that when using the pressure-sensitive adhesive sheet to adhere to the light-filtering sheet and the sensing die, the light-filtering sheet can easily keep parallel to the sensing die for increasing the yield of the sensor package structure. The sensing region of the sensing die of the instant disclosure is sealed by the pressure-sensitive adhesive sheet and the light-filtering sheet, so that the particle pollution problem does not exist during the sensor package structure installing to the other components (e.g., lens).

[0012]Additionally, the production apparatus disclosed in the instant disclosure is used for effectively reducing the producing time of the sensor package structure, and the production apparatus only needs a small scale clean room for receiving therein, thereby reducing the producing cost.

Problems solved by technology

Specifically, after dripping the adhesive (e.g., epoxy resin or silicone) in-between the glass and the die, the adhesive needs a lot of time to solidify by baking.

Thus, the die fixed on the glass by the CSP process needs to spend too much time to reduce the capacity of the package structure.

However, during the said pressing, the adhesive (e.g., epoxy resin or silicone) is pressed to flow radially, and the flow of the adhesive cannot be controlled.

Specifically, when the pressing distribution is not uniform, the glass easily has a tilt to the die for generating a package structure problem, which is the glass non-parallel to the die.

Additionally, when the package structure is formed by the COB process, the die is directly combined to the circuit board by wiring, and the package structure formed by the COB process does not have any glass to protect the die, so that the die has a particle pollution problem installing the package structure to the other components (e.g., lens).

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