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High-frequency module

a high-frequency module and module technology, applied in the direction of printed circuit details, printed circuit aspects, transmission, etc., can solve the problem of increasing isolation and reducing further isolation, and achieve the effect of preventing electromagnetic field coupling and sufficient isolation

Active Publication Date: 2016-04-19
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The design achieves significant isolation between transmission and reception circuits, preventing interference and ensuring reliable signal processing even with SAW duplexers, thereby enhancing the module's performance.

Problems solved by technology

In particular, when the SAW duplexers that each multiplex and demultiplex the transmission signal and the reception signal are used, the isolation further tends to decrease.

Method used

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Examples

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Embodiment Construction

[0035]A high-frequency module according to preferred embodiments of the present invention will herein be described with reference to the attached drawings. The high-frequency module is exemplified by a high-frequency switch module that transmits and receives first, second, and third communication signals using different frequency bands in the present preferred embodiment. FIG. 2 is an external perspective view illustrating the main configuration of a high-frequency module 10 of the present preferred embodiment. The high-frequency module 10 includes a switch IC element SWIC and SAW duplexers SDP1, SDP2, and SDP3.

[0036]The high-frequency module 10 includes a multilayer body 11 in which dielectric layers of a certain number are stacked, circuit elements disposed in the multilayer body 11, and circuit elements mounted on a top surface of the multilayer body. The switch IC element SWIC and the SAW duplexers SDP1, SDP2, and SDP3 are realized by the circuit elements that are mounted. The c...

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PUM

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Abstract

In a high frequency module, mounting lands for reception signal output side ports of SAW duplexers, respectively, on a top surface of a multilayer body are arranged so as to be superposed on reception side external connection lands on a bottom surface of the multilayer body along the layer direction and the mounting lands are directly connected to the reception side external connection lands via holes. Transmission side external connection lands are located on the bottom surface of the multilayer body. The transmission side external connection lands are connected to mounting lands for transmission signal input side ports on the top surface of the multilayer body via certain inner layer electrodes that do not come close to the via holes of the reception system and the via holes.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a high-frequency module that transmits and receives multiple communication signals with a common antenna.[0003]2. Description of the Related Art[0004]Various high-frequency modules have heretofore been proposed, which transmit and receive multiple communication signals using different frequency bands with common antennas. For example, a high-frequency module described in Japanese Unexamined Patent Application Publication No. 2008-10995 includes multiple duplexers each including a pair of surface acoustic wave (SAW) filters and a switch integrated circuit (IC). The SAW duplexers and the switch IC are mounted on a front surface of a multilayer body composing other circuits of the high-frequency module. External connection terminals of the high-frequency module are aligned and formed on a bottom surface of the multilayer body.[0005]In such a high-frequency module, it is necessary to achieve...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H04B7/005H04B1/44H04B1/00H04B1/52H05K1/02
CPCH04B1/44H04B1/006H04B1/52H05K1/0243H05K2201/09227
Inventor KITAJIMA, HIROMICHI
Owner MURATA MFG CO LTD