Low-temperature wear-resistant and acetone-resistant conductive silver paste for PCB, and preparation method thereof

A technology of PCB board and conductive silver paste, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. , to meet the effect of rheological wetting properties

Active Publication Date: 2021-11-19
湖南省国银新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This application is aimed at the phenomenon that the conductive circuit obtained by conductive silver paste falls off from the substrate in the prior art, and many of the current glass powders contain lead and other harmful substances. Substances, unfavorable problems to the environment, provide a kind of low-temperature wear-resistant, acetone-resistant conductive silver paste for PCB board and its preparation method

Method used

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  • Low-temperature wear-resistant and acetone-resistant conductive silver paste for PCB, and preparation method thereof
  • Low-temperature wear-resistant and acetone-resistant conductive silver paste for PCB, and preparation method thereof
  • Low-temperature wear-resistant and acetone-resistant conductive silver paste for PCB, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] A low-temperature wear-resistant, acetone-resistant conductive silver paste for PCB boards, made of the following components by mass:

[0076] Metal silver powder 45% (spherical silver powder 30%, flake silver powder 15%),

[0077] Polymer resin 13.2% (vinyl chloride 1.5%, polyester 3%, amino resin 2%, phenoxy resin 2.5% and acrylic resin 4.2%),

[0078] Organic solvent 37.3% (diethylene glycol ethyl ether acetate 18.3%, propylene glycol butyl ether 8% and DBE11%),

[0079] Functional additives 4.5% (auxiliary wear-resistant filler silicon nitride 0.5%, dispersant polyurethane substances 1.0%, plasticizer dioctyl phthalate 1.2%, defoamer isooctanol 0.3%, antioxidant phenyl Hydroquinone polymer 1.5%);

[0080] The metal silver powder is selected from a mixture of spherical silver powder and flake silver powder, wherein the particle diameter D50 of the spherical silver powder is 0.8 μm, and the tap density is 3.7 g / cm 3 , the particle size D50 of flake silver powder is...

Embodiment 2

[0109] A low-temperature wear-resistant, acetone-resistant conductive silver paste for PCB boards, made of the following components by mass:

[0110] Metal silver powder 50% (spherical silver powder 30%, flake silver powder 20%),

[0111] Polymer resin 15.0% (vinyl chloride 0.6%, polyester 4.5%, polyurethane 1.6%, amino resin 2.3%, acrylic resin 4.4% and phenoxy resin 1.6%),

[0112] Organic solvent 35.0% (diethylene glycol ethyl ether acetate 14.9%, propylene glycol butyl ether 6.1% and DBE14%),

[0113] Functional additives 3.5% (auxiliary wear-resistant filler boron nitride 0.5%, dispersant polyurethane substances 1.0%, plasticizer dioctyl phthalate 1.0%, defoamer isooctanol 0.2%, antioxidant phenyl Hydroquinone polymer 0.6%);

[0114] The metal silver powder is selected from a mixture of spherical silver powder and flake silver powder, wherein the particle diameter D50 of the spherical silver powder is 0.5 μm, and the tap density is 4.0 g / cm 3 , the particle size D50 of...

Embodiment 3

[0120] A low-temperature wear-resistant, acetone-resistant conductive silver paste for PCB boards, made of the following components by mass:

[0121] Metal silver powder 30% (spherical silver powder 15%, flake silver powder 15%),

[0122] Polymer resin 5.0% (vinyl chloride 1%, polyester 0.2%, amino resin 1.5%, polyurethane 1.3% and phenoxy resin 1.0%),

[0123] Organic solvent 45.0% (diethylene glycol ethyl ether acetate 21.0%, propylene glycol butyl ether 5% and DBE19%),

[0124] Functional additive 1.0% (auxiliary wear-resistant filler graphite powder 0.5%, dispersant polyurethane material 0.1%, defoamer isooctyl alcohol 0.2%, antioxidant phenylhydroquinone polymer 0.2%);

[0125] The metal silver powder is selected from a mixture of spherical silver powder and flake silver powder, wherein the particle diameter D50 of the spherical silver powder is 2.5 μm, and the tap density is 2.0 g / cm 3 , the particle size D50 of flake silver powder is 2.0μm, and the tap density is 2.7g...

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Abstract

The invention discloses low-temperature wear-resistant and acetone-resistant conductive silver paste for a PCB, and a preparation method thereof. The conductive silver paste comprises 30-50% of metal silver powder, 5-15% of polymer resin, 35-45% of an organic solvent and 1-10% of a functional additive. The prepared low-temperature wear-resistant and acetone-resistant conductive silver paste for the PCB has the advantages of good stability, transfer printing, boiling resistance, wear resistance, acetone resistance, excellent conductivity, strong adhesive force with a PCB substrate, high hardness, no heavy metals such as lead, cadmium and the like, and meeting of the European Union RoHS environmental protection requirements.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and in particular relates to a low-temperature wear-resistant and acetone-resistant conductive silver paste for PCB boards and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, a printed circuit board refers to the formation of point-to-point interconnection circuits and printed components on an insulating substrate according to a predetermined design, and is a provider of electrical connections for electronic components. Circuit boards are very common in daily life, ranging from small mobile phones, USB flash drives, and cameras to high-end products such as aerospace and high-speed trains. With the increasing variety and quantity of electronic products, it is particularly important to strictly control the quality of circuit boards to improve the competitiveness of electronic products. Among them is the high requirement for the conducti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00Y02E10/50
Inventor 刘韩杨华荣闫仁泉蔡幸然
Owner 湖南省国银新材料有限公司
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