6results about How to "Solve the escape" patented technology

The utility model discloses a kind of tail cutting devices of plastic bottle processing, belong to tail cutting device technical field, it includes pedestal, the rear of the pedestal upper end face is equipped with mobile tail cutting structure, the center of the pedestal upper end face is equipped with clamping structure on two sides, the center of the pedestal upper end face is equipped with dust extraction structure in front, in addition, the utility model, by the combination of multiple buffer columns and compression springs of rectangular arrangement, can realize multiple point elastic contact according to the actual shape of plastic bottle, avoid the damage of bottle body caused by local stress concentration, the sliding fit design of sliding plate and clamping plate, so that rubber clamping pad can automatically adjust contact angle with bottle body contour, always keep maximum contact area in clamping process, solve the problem that fixed clamping surface is unstable to special-shaped bottle body clamping, the elastic coefficient of compression spring is optimized design, enough clamping force can be provided to ensure that bottle body does not shake when cutting, and overload protection can be realized through excessive compression when sudden external force, reduce equipment failure rate.

This invention provides a display panel and display device, comprising: a substrate, a planarization layer, an anode layer, and a pixel definition layer stacked sequentially. The pixel definition layer includes a flat region, several exposed opening regions, and a ramp region disposed between the flat region and the opening regions. The opening regions expose the central region of the anode layer. A light-emitting layer is patterned in the opening regions, on the side of the anode layer facing away from the substrate. A reflective layer is patterned in the side of the pixel definition layer facing away from the substrate, and the reflective layer only exposes the light-emitting layer. At least a portion of the emitted light from the light-emitting layer is reflected by the local reflective layer and guided in a direction perpendicular to the substrate. A transparent cathode layer is formed on the side of the light-emitting layer and the reflective layer facing away from the substrate. This invention solves the problem of light escaping or being absorbed through the pixel definition layer, guiding the emission direction of laterally emitted light to a vertical direction, thereby improving the light extraction efficiency.

The invention discloses waste gas purification equipment for industrial equipment part production, and relates to the technical field of waste gas purification equipment for industrial equipment part production. The waste gas purification equipment for industrial equipment part production comprises a purification tank, a gas inlet pipe is fixed to the right side of the purification tank, and a gas outlet pipe is fixed to the top of the purification tank; a spraying device is arranged on the outer wall of the purification tank and comprises a water tank, a water pump, a water outlet pipe and a spraying pipe. According to the waste gas purification equipment for industrial equipment part production, when waste gas is treated and enters a purification tank from a gas inlet pipe, a motor is started, a rotating shaft can drive a separation plate to rotate, the separation plate can strike the entering waste gas, and therefore a large number of impurities in the waste gas can be struck and fall off; the waste gas is prevented from driving a large amount of solid impurities to be discharged upwards, and the problem that the waste gas containing a large amount of solid particle impurities is discharged upwards to cause blockage of the spraying pipe is solved.

A system and method for ammonia-based desulfurization and decarbonization of phosphogypsum and co-production of ammonium sulfate and calcium carbonate is disclosed. This system removes over 98% of SO₂ from flue gas, reduces CO₂ emissions by 10-20%, and converts over 95% of calcium sulfate dihydrate (the main component of phosphogypsum) into calcium carbonate usable as cement raw material, while also co-producing ammonium sulfate for fertilizer. Ammonia emissions in the tail gas are less than 10 mg / m³. This invention utilizes waste heat from flue gas to deammonize and desorb ammonia-containing slurry, saving energy required for evaporation and improving mass transfer efficiency during desulfurization and decarbonization due to lower flue gas temperature. By recycling the deammoniation-treated slurry as a washing liquid for escaping ammonia and replacing process water with ammonium sulfate solution to prepare the phosphogypsum, the ammonia escape problem is effectively solved, while reducing energy consumption for subsequent ammonium sulfate crystallization and evaporation treatment by approximately 35%. Employing a structural design similar to traditional limestone-gypsum desulfurization towers, this system achieves a technological upgrade of ammonia-based desulfurization and decarbonization without altering the existing main structure of the desulfurization tower, significantly reducing investment costs for technological upgrades. This invention successfully overcomes the technical pain points of ammonia desulfurization and decarbonization technology, such as severe ammonia escape, large washing water volume leading to high energy consumption in subsequent product processing and high equipment modification costs, resulting in significant energy saving, water saving, emission reduction and increased revenue benefits.

The application provides a path planning cooperative control method for ship-borne heterogeneous strong coupling unmanned equipment, relates to the technical field of intelligent control and path planning, and comprises the following steps: considering the longitudinal, transverse and yaw motion of an unmanned tractor and an unmanned carrier aircraft on the deck plane of an aircraft carrier, a three-degree-of-freedom coupling motion mathematical model of the heterogeneous unmanned equipment is established; a virtual force field is constructed according to an improved artificial potential field method, a field strength adjusting operator and a heading disturbance injection term are introduced, and discrete path points are generated; the discrete path points are converted into continuous expected trajectories by using a Gaussian smoothing function; precise trajectory tracking of the unmanned equipment is realized through an adaptive neural network double-layer control architecture, the upper layer controls the unmanned carrier aircraft, the lower layer controls the unmanned tractor, and cooperative control is realized by using the coupling relationship. The application introduces a first-order filter (dynamic surface control technology), effectively suppresses the differential explosion phenomenon, reduces the algorithm complexity, and improves the engineering applicability of the controller.

This invention provides an electrochemical magnetorheological polishing apparatus and method for semiconductor wafers. The polishing apparatus includes: a spindle, a workpiece stage, a polishing disc, a conductive through-hole foam pad, a sealed electrolytic cell, a temperature control module, and a dynamic clustered magnetic field generator. During polishing, the conductive through-hole foam pad acts as an electrolytic framework, improving current utilization and uniformity of global anodic oxidation, enabling precise online control of the electrochemical anodic oxidation rate. Magnetic particles, under the action of the dynamic magnetic field, synergistically work with the foam pad to enhance shear yield stress and abrasive holding force, improving the uniformity and stability of mechanical removal. Abrasive particle renewal and self-sharpening are achieved through the clustering effect of the dynamic magnetic field. Combined with online processing gap control, this allows for staged rough and fine polishing of the wafer. This invention significantly improves wafer planarization efficiency and surface quality, possessing promising application prospects and industrialization value in semiconductor power device manufacturing.