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Radiating fin and fin assembly

A technology of heat dissipation fins and fins, which is applied in the direction of electrical components, heat exchange equipment, electric solid devices, etc., can solve the problems of affecting welding quality, retention, increase in contact thermal resistance between heat dissipation fins and substrates, etc., and maintain stability , reduce contact thermal resistance, improve the effect of welding quality

Inactive Publication Date: 2007-10-24
DELTA ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As shown in FIG. 1C , in the existing method of combining heat dissipation fins 102 by soldering, because the welding parts 102b of each heat dissipation fin 102 are closely adjacent to each other, the flux 106 in the solder under the welding parts 102b will be affected. Adjacent fins (such as the A-A surface shown in the figure) are blocked and cannot escape, but can only flow out in a small amount from the shorter side of the welding part 102b, causing a large amount of flux 106 to remain in the fin welding part after welding The welding surface between 102b and the substrate 104 makes it difficult to control the stability of the welding medium, which not only affects the welding quality but also significantly increases the contact thermal resistance between the cooling fins and the substrate

Method used

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  • Radiating fin and fin assembly
  • Radiating fin and fin assembly
  • Radiating fin and fin assembly

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Embodiment Construction

[0018] FIG. 2A is a perspective view showing the structure of the heat dissipation fin 12 according to an embodiment of the present invention.

[0019] As shown in FIG. 2A , the heat dissipation fins 12 are formed by bending a sheet of heat-conducting material into an L-shaped cross-section, and include a large-area heat dissipation portion 12 a and an elongated welding portion 12 b. The sheet-shaped heat-conducting material can be bent to form the welding portion 12b by means of sheet metal processing, and the heat-conducting material can be a high-heat-conducting material composed of aluminum, copper, aluminum alloy, copper alloy, or a mixture thereof.

[0020] According to the design of the present invention, the welding portion 12b has a plurality of notches 14 formed by the edge of the sheet-shaped heat-conducting material inwardly toward the bend. The shape of the notches 14 can be in any form, and the number is not limited. Portion 12b has a serrated edge. Therefore, w...

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Abstract

The invention provides a cooling fin and fin component, where the former is composed of a sheet heat conduction material formed with notches, and the part of the material is bent to form a welding part for welding to a substrate; the latter is composed of a base slice and many cooling fins. The structures of the cooling fin and fin component can retain the stability of welding medium between the cooling fin and the substrate, thus able to improve the welding quality and effectively reduce contact thermal resistance between the cooling fin and the substrate.

Description

technical field [0001] The invention provides a cooling fin and a fin assembly, in particular a fin and a fin assembly which can effectively maintain the stability of a welding medium during welding and assembly. Background technique [0002] Today's heat dissipation fins are mostly manufactured by aluminum extrusion. However, the ratio of height to thickness of heat dissipation fins manufactured by aluminum extrusion process will be limited by the current processing technology, and the heat dissipation performance cannot be further improved, so it is difficult to meet Today's electronic components have greatly increased heat dissipation requirements. Therefore, it can be considered to be replaced by welding assembly. [0003] FIG. 1A is a perspective view showing the structure of a conventional heat dissipation fin 102 used in a soldering process. As shown in FIG. 1A , the heat dissipation fin 102 is formed by bending a sheet of heat-conducting material into an L-shaped c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367F28F7/00
Inventor 简兆南施荣松吴玮芳陈锦明
Owner DELTA ELECTRONICS INC
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