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Reliability screening method of infrared focus planardetector

An infrared focal plane and screening method technology, applied in the field of electrical welding reliability screening, can solve problems such as welding performance failure, In bump fatigue damage, etc., and achieve the effects of improving accuracy, avoiding interference, and fast speed

Inactive Publication Date: 2007-12-12
SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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  • Abstract
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Problems solved by technology

Therefore, the fatigue damage of In bumps in these areas is the main reason for the failure of soldering performance

Method used

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  • Reliability screening method of infrared focus planardetector
  • Reliability screening method of infrared focus planardetector

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Embodiment Construction

[0024] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings:

[0025] The present invention takes the HgCdTe infrared focal plane detector as an embodiment, and the HgCdTe infrared photosensitive element array chip 4 on the GaAs substrate has an area of ​​4×6mm 2 , The base area of ​​the Si-based readout circuit 5 is 6×9mm 2 . When designing the device, 40 In bumps were added at equal intervals around the photosensitive element array chip, and 40 In bumps were added correspondingly around the Si-based readout circuit. These added In bumps can be used in the preparation of light. The sensitive array chip and the readout circuit are manufactured by the way without increasing the manufacturing process steps and complexity of the device. When the light-sensitive array chip and the readout circuit are interconnected by reverse welding, the In bumps added between the four sides constitute 40 single connected resi...

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Abstract

This invention discloses a selection method for the reliability of an infrared focal plane detector, which adds several mutual connected In convex points on the surroundings of a photosensitive array chip and adds several mutual connected In convex points on the surroundings of a read-out circuit, when the chip and the read-our circuit are welded face-down to make up of a focal plane detector, the added several In convex points will compose several single connected resistors and the common connected welding points of the chip and the circuit are taken as a common connected resistor, then the single connected resistors and the N common connected welding points are parallel to constitute a test circuit to be tested with a resistor test device and the resistance value is judged.

Description

Technical field [0001] The invention relates to the detection technology of an infrared focal plane detector, in particular to a method for screening the reliability of electrical welding between the light-sensitive array chip of the focal plane detector and the readout circuit. Background technique [0002] In response to the urgent needs of infrared thermal imaging systems for detectors, infrared focal plane detectors have developed rapidly in the past two to thirty years. At present, the infrared focal plane detector has developed to the third generation with large area array, miniaturization, multicolor and integration as the main features. The infrared focal plane detector is composed of an infrared light-sensitive array chip and its corresponding readout circuit, and both are implemented based on the flip-chip bonding technology of metal indium (In) bumps. This longitudinal welding must not only have sufficient mechanical strength to ensure the mechanical robustness between...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66G01R27/02G01R31/00
Inventor 叶振华胡晓宁廖清君
Owner SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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