Substrate processing apparatus
A substrate processing device and a technology for substrates, which are applied in the directions of photolithographic process exposure devices, transportation and packaging, lighting and heating equipment, etc., can solve the problems of reduced processing capacity, inconvenience, and inability to reflect the processing capacity of coating and developing devices, etc. To achieve the effect of improving processing power
Inactive Publication Date: 2008-02-20
TOKYO ELECTRON LTD
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Problems solved by technology
[0006] However, wafers processed by the patterning system are sent to an external inspection unit for pattern inspection before being sent to the next process, which is one of the reasons for the decrease in throughput.
In addition, when wafers processed by other patterning systems are being inspected in the aforementioned inspection unit, it is necessary to wait, so that the processing capacity of the coating and developing device cannot be reflected in the overall processing
In addition, when the operator of the system needs to know the result of the pattern inspection, he must go to another place to get the result. Therefore, for example, it is inconvenient to study the treatment plan based on the inspection result.
Method used
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[0062] Hereinafter, embodiments of the present invention will be described.
[0063] Fig. 1 is a schematic external view showing the inside of the embodiment in perspective form. Fig. 2 is a schematic plan view. In the figure, S1 is a storage box workstation, S2 is an inspection workstation for performing predetermined inspections on wafer W, and S3 is a wafer W is a processing workstation for substrate processing such as coating processing and development processing, S4 is an interface workstation, and S5 is an exposure device.
[0064] The storage box workstation S1 has: a storage box worktable 21 that constitutes a placing section for placing wafer storage boxes constituting, for example, four substrate storage boxes containing a plurality of substrates, such as 25 wafers W. (Hereinafter referred to as "housing box") 22; the housing box 22 on the housing box table 21; the transfer arm 23, which constitutes the transfer of the wafer W with the transfer section 33 of the inspecti...
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The invention discloses a substrate processing device which comprises a carrier input / output portion for allowing the input and output of a carrier with a plurality of substrates; a carrier workstation of a first transfer portion for transferring the substrates with respect to the carrier on the carrier input / output portion; a processing station that is arranged adjacently to the carrier workstation in a first direction of the carrier workstation and comprises a coating portion for coating a resist on the substrates, a developing portion for developing the substrates after exposition and a main transfer portion for transferring the substrates with the coating portion and the developing portion and transferring the substrates with the first transfer portion; an interface station arranged between an exposure device and the processing station in the first direction and used for transferring the substrates with the exposure device; and a first inspection station arranged adjacent to the carrier station, the processing station or the interface station in a second direction substantially vertical to the first direction and used for inspecting the substrates.
Description
[0001] This application is a divisional application of the application whose application date is July 12, 2001 and the application number is 01123126.2. Technical field [0002] The present invention relates to a substrate processing apparatus and a substrate processing method for performing, for example, resist solution coating processing and development processing on substrates such as semiconductor wafers or glass substrates for liquid crystal displays. Background technique [0003] In the manufacturing process of semiconductor devices, a kind of photolithography is used to coat a resist solution on a substrate such as a semiconductor wafer, expose the resist film with a photomask, and develop a desired resist pattern on the substrate after development. technology. [0004] This photoetching is performed in a patterning system that connects the exposure device to the coating and developing device. As a coating and developing device, for example, the processing of semiconductor ...
Claims
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IPC IPC(8): H01L21/00H01L21/027H01L21/66H01L21/68G03F7/00G03F7/20B65G49/05G03F7/16H01L21/677
Inventor 佐藤纪胜绪方久仁惠木村义雄富田浩中岛清次神谷英彦
Owner TOKYO ELECTRON LTD