Automatic assembing machine

Abstract

Automatic assembling machine capable of combining first set with second set includes following parts: a worktable for placing first set, and supporting second set above the first set; a medium supply unit for supplying a medium to a interface between first set and second set; a pressing down unit for pushing second set to the first set in order to make second combination part combine with corresponding first combination part.

Description

Technical field [0001] The invention relates to an automatic assembling machine, in particular to an automatic assembling machine capable of quickly combining a first device and a second device, and is particularly suitable for combining a heat sink with a chip set on a circuit board. Background technique [0002] In the process of assembling, it is often necessary to combine one device with another device, and for a specific purpose, the bonding surface between the two devices is coated with a medium with a specific function, such as thermal conductive paste or thermal conductive glue. [0003] For example, referring to FIG. 10, in the traditional manufacturing process, to bond a heat sink 90 to a chip 92 on a circuit board 91, an operator manually operates a syringe to dispense the thermal paste 93 is injected into the center of the surface 921 of the chip 92. Then, proceed to the next step of assembly. [0004] Referring to FIG. 11, before assembling, first fix the heat sink 9...

AI Technical Summary

Problems solved by technology

[0007] Although the above-mentioned traditional manufacturing process can be used to achieve the purpose of combining the heat sink 90 to the circuit board 91, however, because at least several steps are required, the efficiency is not high.

[0008] Furthermore, after the thermal paste in the injection cylinder is used up, it takes time to refill it, which makes the overall operation efficiency low

[0009] More importantly, when operating the syringe, due to the involuntary shaking of the operator's hands or the influence of other factors, the injection amount of the thermal paste 93 cannot reach the standard or is not injected into the proper position of the chip 70, which will affect Conduction efficiency of chip 70 to heat sink 90

[0010] In addition, during the process of injecting the thermal paste 93 to the chip 70, the output port of the syringe often touches the chip 70 due to human negligence, which often causes the chip 70 to be damaged.

[0011] In general, the process of combining the heat sink 90 to the circuit board 91 in the past has indeed used too many manual steps, which not only wastes human resources, but also leads to poor production efficiency and low product quality.

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