Method of producing copper oxychloride using circuitboard etching waste liquid
A technology for etching waste liquid and copper oxychloride, which is applied in the direction of copper oxychloride, chemical instruments and methods, copper halide, etc., can solve the problems of waste of iron resources, high processing cost, and large water consumption, and achieve recycling, The process is simple and stable, and the effect of reducing harm
Examples
Embodiment 1
[0034] Sodium sulfite was added to acidic and alkaline two kinds of circuit board etching waste liquids to form insoluble substances, and they were stirred and mixed respectively; The concentration of ions is 250g / L, and the insoluble substances are removed to obtain two kinds of clear solutions, acidic and basic. These two kinds of acidic and basic clear solutions are respectively added to the reactor at the same time with a flow controller for neutralization reaction. And the flow rate of the acidic solution is 200L / h, and the flow rate of the alkaline solution is 400L / h, so as to ensure that the pH value of the reaction solution is stable between 4.5 and 5.5 during injection, react at a constant temperature of 80°C, and stir the reaction solution until the copper oxychloride Until the crystals are completely precipitated from the reaction solution; filter to obtain copper oxychloride crystals and filtrate, rinse the copper oxychloride crystals with pure water, and dry at a t...
Embodiment 2
[0036] Add sodium sulfite to the acidic and alkaline circuit board etching waste liquids to form insoluble substances, and stir and mix them separately; measure the concentration of chloride ions in the acidic circuit board etching waste liquid to be 100g / L, and the alkaline circuit board etching waste liquid ammonia The concentration of ions is 250g / L, and the insoluble substances are removed to obtain two kinds of clear solutions, acidic and basic. These two kinds of acidic and basic clear solutions are respectively added to the reactor at the same time with a flow controller for neutralization reaction. And the flow rate of the acidic solution is 150L / h, and the flow rate of the alkaline solution is 400L / h, so as to ensure that the pH value of the reaction solution is stable between 4.5 and 5.5 during injection, react at a constant temperature of 80°C, and stir the reaction solution until the copper oxychloride Until the crystals are completely precipitated from the reaction...
Embodiment 3
[0038] Sodium sulfite was added to the acidic and alkaline circuit board etching waste liquids to form insoluble substances, and they were stirred and mixed separately; The concentration of ions is 250g / L, and the insoluble substances are removed to obtain two kinds of clear solutions, acidic and basic. These two kinds of acidic and basic clear solutions are respectively added to the reactor at the same time with a flow controller for neutralization reaction. And the flow rate of the acidic solution is 300L / h, and the flow rate of the alkaline solution is 400L / h, so as to ensure that the pH value of the reaction solution is stable between 4.5 and 5.5 during injection, react at a constant temperature of 80°C, and stir the reaction solution until the copper oxychloride Until the crystals are completely precipitated from the reaction solution; filter to obtain copper oxychloride crystals and filtrate, rinse the copper oxychloride crystals with pure water, and dry at a temperature ...
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Description
Claims
Application Information
- IPC
- C01G3/06; C02F1/52; C02F1/70; C02F1/58; C01C1/16
- Inventors
- 阮玉根