Method for remeasuring semiconductor elements

Abstract

This invention relates to a method for re-testing semi-conductor elements including the following steps: 1, providing a first semiconductor element carrier containing multiple tested semiconductor elements, 2,taking out the tested elements from first element carried by a fetch-and-put machine and putting them on a film frame in terms of the first map information, in which, the first map includes information of the position coordinate of the elements preset on said film frame, 3, putting the film frame in a test machine and re-testing the semiconductor elements based on the first map information, 4, putting the film frame carrying the element in the fetch and put machine and taking out the elements based on the re-tested result to sort them based on the grades and put them on a second carrier orderly.

Description

technical field [0001] The invention relates to a method for testing a semiconductor device, in particular to a method for retesting a semiconductor device, which can retrieve the semiconductor device mounted on a carrier for retesting. Background technique [0002] After the wafer is manufactured, it usually needs to go through the process of packaging and testing, and then make the signal connection between the chip and the printed circuit board (motherboard). Among them, the packaging process includes procedures such as wafer dicing, die attaching, wire bonding, and encapsulating. However, the chip may be damaged or the signal route may be wrongly connected during the wafer manufacturing or packaging process. Therefore, the components after the packaging process usually need to go through testing steps to determine whether the chip function is correct. [0003] According to the requirements of the product, the testing stage can be carried out before the chip is packaged ...

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Problems solved by technology

[0004] Based on the above, if it is necessary to re-grade the chips that have been placed in the chip carrier, such as the film carrier tray, for example, when the qualified chips need to be subdivided into two different grades, because the chip carrier cannot be placed in the testing machine Testing in Taichung will cause the chip to be scrapped; or, when the pass rate of the chip is too low, it is necessary to further take out and leave on the film rack 222 the ones that are closer to the pass standard among the previously judged unqualified chips to improve the pass rate of the chip. The machine cannot test the irregularly arranged chips left on the film frame 222, resulting in limited testing flexibility

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