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Epoxy-glue packing method for low-temperature infrared detector and special device

A technology of infrared detector and packaging method, which is applied in semiconductor device, semiconductor/solid-state device manufacturing, sustainable manufacturing/processing, etc. Air source, improving thermal conductivity, and the effect of uniform adhesive layer

Active Publication Date: 2008-07-30
SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

There are two problems with this method of operation: one is that it cannot effectively degas, because there are micropores in the epoxy glue operated under atmospheric pressure, when some kind of cracks in the epoxy glue or other factors cause the micropores to rupture, the micropores will become In order to destroy the "air source" of Dewar's vacuum degree; the second is that when the infrared focal plane device chip is bonded to the base with epoxy glue, since the chip surface is delicate, direct contact and pressure on the chip surface is not allowed
The result of this operation is that the epoxy adhesive layer is relatively thick or uneven in thickness, resulting in poor thermal conductivity of the epoxy adhesive and a decrease in heat conduction, which affects the rapid cooling of the detector.

Method used

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  • Epoxy-glue packing method for low-temperature infrared detector and special device

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Embodiment Construction

[0014] Firstly, the focal plane detector chip and the base to be bonded are subjected to routine operations, that is, the epoxy glue is evenly coated on the bonding surface of the base, and then the focal plane device chip is gently placed on the predetermined bonding position, and then the It is placed on the measuring instrument, and the position of the detector chip is fine-tuned to make the position of the detector chip accurate. At this time, a layer of epoxy glue is formed between the detector chip and the surface of the base. Then the detector chip and the base as a whole are placed as a sample 10 such as figure 1 In the shown vacuum chamber, the sample 10 is fixed on the sample stage 9 with a clamp, and the sealing cover 2 is covered. Connect the exhaust pipeline 4 with the vacuum unit, and start the vacuum pump. At this moment, both the intake needle valve 7 and the exhaust needle valve 5 are in the closed state. Then slowly open the air extraction needle valve 5 t...

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Abstract

This invention discloses a package method and a special device for epoxy gel of a low temperature infrared detector including: putting a low temperature infrared detector needed to be sealed in a special cavity, pumping the cavity to expel bubbles of the epoxy gel layer in the detector then to charge the cavity to realize a package method of non-contact uniform pressing to the device.

Description

technical field [0001] The invention relates to a packaging process of a low-temperature infrared detector, in particular to a method for packaging a low-temperature infrared detector with low-temperature epoxy glue and a special device required for realizing the method. The method can realize non-porous bonding and non-contact uniform pressure packaging for the detector. technical background [0002] The highly sensitive infrared focal plane detector is a detector that works at low temperature (77K). In order to cool the detector to the required low temperature, the method of high vacuum heat insulation is usually used to package the detector in a high vacuum Dewar. Device packaging is generally bonded with various low-temperature epoxy adhesives, and the operation is carried out under atmospheric pressure. There are two problems with this method of operation: one is that it cannot effectively degas, because there are micropores in the epoxy glue operated under atmospheri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/18H01L21/56
CPCY02P70/50
Inventor 张勤耀吴云
Owner SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI