Variable resistor

Abstract

The object of the invention is to provide a variable resistor not affected by resin powder produced between a substrate and a rotating shaft. To achieve the object, the variable resistor is constituted so that its resistance value may be adjusted by sliding the contact pieces 35a and 35b of a slider 35 on a collector and a resistor concentrically provided on the surface of the substrate 10. In the center hole 11a of the substrate 10, a recessed section 11b having a stepped surface 11c is formed, and, on the rotating shaft 30, a stepped surface 33 is formed correspondingly to the stepped surface 11c of the recessed section 11b. The stepped surfaces 11c and 33 are brought into contact with each other. When the rotating shaft 30 is rotated, the resin powder is generated by frictional. However, the resin powder is not scattered on the surface of the substrate 10.

Description

technical field [0001] The present invention relates to a variable resistor. In particular, it relates to a variable resistor whose resistance value is adjusted by sliding a slider mounted on a rotatable shaft on a resistor and a current collector on a substrate. Background technique [0002] As a conventional rotary variable resistor provided with a sliding contact, one disclosed in Japanese Unexamined Patent Publication No. 2000-138109 is known. Such as Figure 7-10 As shown, this varistor has a center hole (bearing hole) 101 on a substrate 100 made of a resin molded product, and first and second terminals 112 and 113 are embedded therein. Ends 112 a , 113 a of terminals 112 , 113 protrude from the side surface of substrate 100 , and the other ends 112 b , 113 b are exposed from the upper surface of substrate 100 . Concentric annular current collectors 104 and substantially annular resistors 105 are formed on the substrate 100 . The current collector 104 is connected to...

AI Technical Summary

Problems solved by technology

However, this type of bonding is between the metal material 112 and the sintered material of the paint, that is, the bonding between dissimilar substances, and sufficient strength cannot necessarily be obtained.

In this way, the load when the terminal is cut or bent, or the stress caused by the difference in thermal expansion coefficient between the substrate 100 and the collector 104, may cause the peeling of the joint, making the reliability of the electronic component sex decline

Moreover, due to the sulfidation of silver, the contact resistance will increase, resulting in a decline in product quality.

[0012] Moreover, since the current collector 104 is formed by coating and sintering the paint on the substrate 100, it will increase the equipment and process, resulting in an increase in cost.

Images