Machining apparatus

Abstract

The invention provides a processing equipment which does not require a large installation space for a lighting device and has a contour recognition function to enable recognizing the contour of the entire body of a wafer. This equipment is for processing the workpiece of a workpiece assembly, wherein the workpiece is supported on the surface of a transparent or translucent protection tape pasted on an annular support frame having an opening in a central portion. The processing equipment comprises a belt-like light-emitting means which is located between a cassette placement table for mounting a cassette for storing the workpiece assembly and a temporary placement table, has a length of not less than the maximum length of a carry-out means in a direction perpendicular to a carry-out direction in the opening of the support frame, and a width smaller than the maximum length; an imaging means which is arranged opposite to the belt-like light-emitting means, and images the contour of the workpiece of the workpiece assembly, located between the belt-like light emitting means and the imaging means; and a contour recognizing means for recognizing the contour of the entire body of the workpiece, based on the information of the image picked up by the imaging means.

Description

technical field [0001] The present invention relates to a processing device having a function of recognizing the contour of a flat workpiece such as a semiconductor wafer. technical background [0002] In the manufacturing process of semiconductor devices, the surface of a roughly disk-shaped semiconductor wafer is divided into a plurality of regions by dividing lines called striving lines arranged in a grid pattern. Circuits such as IC and LSI are formed in the area. Then, by cutting the semiconductor wafer along planned dividing lines, the regions where the circuits are formed are divided, and individual semiconductor chips are manufactured. In addition, optical device wafers such as gallium nitride-based compound semiconductors are laminated on the surface of a sapphire substrate are also cut along planned dividing lines to be divided into individual optical devices such as light-emitting diodes and laser diodes, and are widely used in electrical equipment. . [0003] ...

AI Technical Summary

Problems solved by technology

[0009] Therefore, in order to recognize the entire outline of the wafer with certainty, it is necessary to use an illumination mechanism and an imaging mechanism capable of illuminating the entire wafer. In particular, a considerable space is required for arranging the illumination mechanism, which causes a problem of increasing the size of the processing equipment.

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