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System and method for active vibration isolation and active vibration cancellation

A technology of mechanical vibration and shock absorber, applied in vibration suppression adjustment, non-rotation vibration suppression, shock absorber, etc., can solve the problem that the exciter and the sensor are not integrated together.

Inactive Publication Date: 2008-10-29
KONINKLIJKE PHILIPS ELECTRONICS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Typically, actuators and sensors in active vibration isolation / cancellation systems are not integrated

Method used

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  • System and method for active vibration isolation and active vibration cancellation
  • System and method for active vibration isolation and active vibration cancellation
  • System and method for active vibration isolation and active vibration cancellation

Examples

Experimental program
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Embodiment Construction

[0038] The limitations of the performance of active isolation / cancellation systems can be described using gain and phase relationships in cybernetics.

[0039] figure 1 A schematic diagram of a system 100 illustrating the basic vibration damping principles is shown. The schematic 100 includes a main plate 102 of about 1000 [kg], a ground shock absorber 104 , a rigid body (also called a ground spring) 106 and a ground 108 . The main board 102 and the ground 108 are connected to each other through a rigid body 106 and a shock absorber 104 . Rigid body 106 is so stiff that it provides a resonant frequency of 1 Hz. The value of the damper 104 is generally such that the overall system 100 is marginally damped. The force sensitivity of such a system is shown in FIG. 2 .

[0040] In low frequencies, a force of 1 [N] will give a vibration of less than 1 [mm / s2]. When greater than 1[Hz], the vibration amplitude will be a constant 1[mm / s2]. Judging from the products currently on t...

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PUM

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Abstract

A damper system 400 includes a sensor 430, an electrical controller 2295 and an actuator 410. The sensor 430 measures mechanical vibration and produces an electrical input signal caused by the vibration. The sensor 430 mounts between a body and a reference mass 422. The electrical controller 2295 is responsive to the electrical input signal and producing an electrical output signal. The actuator 410 is responsive to the electrical output signal to produce a force between the body and an external body. The sensor 430 and the actuator 410 are located substantially to reduce delay, which consists of the sum of an acoustic signal delay and an electronic signal delay in the actuator 410 and the sensor loop.

Description

technical field [0001] The present invention relates to a system and method for vibration isolation and elimination, especially suitable for high-precision wafer chip production and testing equipment, but not limited to this application. Background technique [0002] Products using active vibration isolation and cancellation technologies are available on the market, but their effectiveness needs to be improved. Active vibration isolation and cancellation technology (also known as air mount technology) for IC production and inspection equipment needs to become more effective as the production of chips requiring smaller sized features advances. Typically, the actuators and sensors in active vibration isolation / cancellation systems are not integrated. For example, US Patent 6,286,644, Schubert discloses and describes an active vibration isolator, wherein in Figure 7, the sensor 'P0' and the air spring actuator 'AS' are separate elements from each other. Contents of the inven...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F16F15/027F16F7/10F16F15/00F16F15/03
CPCF16F15/03F16F7/1005F16F15/02F16F2230/08H01L21/02H01L22/00
Inventor T·P·H·瓦梅达姆
Owner KONINKLIJKE PHILIPS ELECTRONICS NV
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