Light-emitting diodes pack and its packing method

A technology of light-emitting diodes and packaging methods, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of color spots, efficiency reduction, and efficiency reduction, and achieve easy dispersion, high brightness, and high efficiency. White light, luminous color uniform effect

Inactive Publication Date: 2008-11-26
LEJIN GUANGDIAN ELECTRONIC CO LTD SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0020] In addition, in order to prevent the aggregation phenomenon between the particles, the surface treatment is basically required, so that as time goes by, the aggregation phenomenon between the particles occurs, resulting in a decrease in efficiency.
[0021] like figure 1 As shown, if the dispersion is not uniform, uniform light emission cannot be expected. The higher the phosphor content, the more serious the problem will be, and color spots will occur, which will infinitely reduce the efficiency of the device.

Method used

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  • Light-emitting diodes pack and its packing method
  • Light-emitting diodes pack and its packing method
  • Light-emitting diodes pack and its packing method

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Experimental program
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Embodiment Construction

[0046] Embodiments of the light emitting diode package and its packaging method of the present invention will be described in detail below with reference to the accompanying drawings.

[0047] figure 2 It is a schematic structural view of the state in which the polymer resin in which the organic and inorganic mixed phosphor particles containing organic phosphor molecules are dispersed in the porous inorganic chemical particle of the present invention is sprayed in the light-emitting diode, and the protection is connected to the The light-emitting diodes 110 in the cup-shaped reflector of the lead frame 120, the porous interior of the porous inorganic chemical particles, the organic and inorganic mixed phosphor particles 132 containing organic phosphor molecules 131 are dispersed, and the polymer resin 130 is sprayed. .

[0048] The organic-inorganic mixed phosphor particle 132 is defined as follows: organic phosphor molecules 131 are included in the pores of the porous inorg...

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Abstract

The invention is concerned with the bundle and packaging method of LBD. It formed by a couple of isolated exterior derivation connection ends, and there is a cup-shaped down-lead frame of baffle-board at the end of one connection end, and a LBD connects with the baffle-board of the said down-lead frame. The LBD connects with the wire of exterior derivation connection end of the down-lead frame in type of electricity connection. There is macromolecule resin to protect the LBD and the organic and un-organic mixed phosphor grain with organic phosphor molecule in the multi-hole un-organic grain of chemic matter ejected to the baffle-board. It also owns a molding part to protect and mold the said macromolecule resin, wire, a part of macromolecule resin and down-lead frame. Because the ejected LBD owns the macromolecule resin for dispersing organic and un-organic mixed phosphor grain of the organic phosphor, the decentralization is easy to get white light with high brightness and high efficiency to keep the safety of organic phosphor without lose of light.

Description

technical field [0001] The invention relates to the technology of LED packaging (Package) and packaging method thereof. Background technique [0002] In general, light emitting diodes are small, can emit brightly colored light, have good initial drive characteristics and shock resistance, and have the advantages of being as robust as ON / OFF lighting. [0003] Due to such characteristics, various indicators and various light sources can be widely used. [0004] Recently, super-brightness and high-efficiency R, G, and B light-emitting diodes have been developed, and large-screen light-emitting diode display devices using light-emitting diodes have become common. [0005] Such a light-emitting diode display device can be operated with a small power consumption, and has good characteristics of light weight and long life. [0006] In addition, light-emitting diodes have recently been tried to make white light-emitting light sources. [0007] In this way, in order to obtain whi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/56
CPCH01L2224/8592H01L2924/181H01L2224/48091H01L2224/48247H01L2224/48257H01L2924/00014H01L2924/00012
Inventor 金憘廷李圣恩
Owner LEJIN GUANGDIAN ELECTRONIC CO LTD SHANGHAI
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