Side-touched cell-phone camera mould set machining method

Abstract

The invention discloses a processing method for a side-contact mobile phone camera module, relating to a production and processing technology for a side-contact slot-type mobile phone camera module. According to the technical scheme provided by the present invention, the processing method of the side-contact mobile phone camera module includes, a, hollowing out: hollowing out the position corresponding to the dispensing area on the soft protective film, and retaining the position of the protection area; b, sticking the film: The hollowed-out soft protective film is pasted on the printed circuit board with components in the module against the corresponding positioning points on the module; c, glue dispensing: use a glue dispenser to evenly coat the glue on the soft protective film and The part where the printed circuit board is in contact, and then install the lens on the module; d. Baking: Assemble the mold with the colloid on the tray, send it to an air-drying oven, and bake it at 80°C to 85°C for 2 to 2.5 hours , to solidify the colloid; e, to remove the film: after the baking is finished, use a knife to cut the soft protective film along the part of the printed circuit board without circuits and components, and tear it off. The invention can remove the influence of the glue overflow phenomenon in the dispensing process on the side contacts.

Description

technical field [0001] The invention relates to a production and processing technology of a side contact slot type mobile phone camera module. Background technique [0002] With the popularization of mobile phone camera functions, the demand for mobile phone cameras is increasing. The traditional design ideas and methods use flexible circuit boards with connectors to install and contact modules. The batches are often not large, because mobile phones are updated quickly. Different styles may require very different shapes of flexible circuit boards, so that the design of flexible circuit boards needs to be continuously updated, which increases the processing cost of mobile phone camera modules in the new product development stage, and the design to solve this problem The best way to think about it is to standardize, so a new type of connector-socket type appeared. Its purpose is to install the camera module as conveniently as plugging in a socket. At present, there are mainl...

AI Technical Summary

Problems solved by technology

[0003] For side-contact socket connectors, since the contact point is on the side and the shape of the printed circuit board has local depressions, the glue is easy to flow down during the dispensing process or overflow during the baking process

According to the usual processing technology, it is difficult to control the phenomenon of glue overflow. If the glue sticks to the contacts of the printed circuit board, it will be difficult to wipe it off, resulting in the failure of the module function. See Figure 2

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