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Heat abstractor assembling

A heat dissipation device and heat sink technology, which is applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve problems such as unfavorable fan frame manufacturing, increased fan manufacturing costs, and prolonged fan assembly process

Inactive Publication Date: 2009-01-28
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the slot body is usually an irregularly shaped cavity, which is not conducive to the manufacture of the fan frame
In addition, the plug is a single component separate from the fan frame, which increases the manufacturing cost of the entire fan and also prolongs the fan assembly process

Method used

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  • Heat abstractor assembling
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Examples

Experimental program
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Embodiment Construction

[0012] Please see figure 1 with figure 2 , the heat dissipation device combination of the present invention includes a heat sink 10 and a fan 20 . Three screws 30 pass through a support plate 26 of the fan and combine with the heat sink to fix the fan 20 to the heat sink 10 .

[0013] The fan 20 includes a hub 22 , and fan blades 24 extending outward from a periphery of the hub 22 . The hub 22 and the blades 24 are carried by a support plate 26 . The support plate 26 defines three through holes 262 for passing the screws 30 therein. Two parallel wires 28 protrude from the support plate 26 and can be connected to a power source (not shown) to power the fan 20 . The wires 28 are bundled together side by side with an overall thickness equal to the largest diameter of the wires 28 and an overall width equal to the sum of the diameters of the wires 28 .

[0014] Please see figure 1 Referring to FIG. 5 , the heat sink 10 can be integrally formed by aluminum extrusion, which i...

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PUM

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Abstract

A heat abstractor combination is disclosed that includes a fan and a radiator, and the fan is fixed on the radiator and possesses at least two directing lines tied up side by side, and the radiator includes a center body and a dry plate radiating flange extending from the center body. Said directing lines is placed in the passage between the two adjacent radiating flanges along the outer rim of center body, and a blocking part is mounted on the one radiating flange of two adjacent radiating flanges to prevent the directing lines from sliding the passages. The design can prevent the directing lines from being loose and involving fan caused by the shake of fan or the air flow generated by the fan.

Description

【Technical field】 [0001] The invention relates to a heat dissipation device combination, in particular to a heat dissipation device combination including a radiator and a fan. 【Background technique】 [0002] A heat sink is a commonly used device for cooling electronic components such as a central processing unit and a graphics card chip. Wherein, a commonly used radiator includes a cylindrical central body and a plurality of cooling fins extending outwardly from the periphery of the central body. The central body absorbs heat from the electronic components and transfers the heat to the heat sink for dissipation. [0003] In order to enhance the heat dissipation capability of the radiator, a fan is generally arranged on the top of the radiator in the industry. The fan continuously blows cold air to the cooling fins of the radiator, accelerating the cooling fins to dissipate heat outward. Wires are arranged on the fan, and the wires electrically connect the fan with a power...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20H05K7/20H01L23/34
CPCH01L2924/0002H01L2924/00
Inventor 陈兵彭学文
Owner FU ZHUN PRECISION IND SHENZHEN
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