Method for producing white light luminous diode

Abstract

The invention relates to a preparing method of white light LBD that includes following steps: (A) providing a basis; (B) a LBD grain is set on said basis; (C) an outer fluorescence wall is set on said basis and surrounds said LBD grain; and (D) a inner fluorescence layer is set in space which is defined by said outer fluorescence wall, and fills said space. The invention divides the production of fluorescence layer into two steps, firstly setting an outer fluorescence wall at around of LBD grain, then forming an inner fluorescence layer in space defined by the outer fluorescence wall to compose an integral fluorescence layer whose thickness is even, defining figuration of the integral fluorescence layer by setting the outer fluorescence wall to control the thickness of the integral fluorescence layer possess consistency, the white light LBD can emit even white light, it resolves problem that white light emitted by ago LBD is not even.

Description

technical field [0001] The invention relates to a method for manufacturing a white light emitting diode, in particular to a method for manufacturing a fluorescent layer of a light emitting diode capable of emitting uniform white light. Background technique [0002] Light-emitting diodes (ie, diodes) have the advantages of small size, light weight, good shock resistance, and fast response, and can be widely used as light sources for various indicators and displays. In particular, the white light emitting diodes developed in recent years tend to replace general tungsten bulbs or fluorescent tubes as lighting sources. [0003] U.S. Patent No. 5,998,925 proposes a technical solution, which is a white light-emitting diode that uses a blue light-emitting diode grain with a phosphor layer. The phosphor layer can absorb part of the blue light emitted by the light-emitting diode grain and convert it It is yellow light, so that the yellow light converted by the fluorescent layer can ...

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Problems solved by technology

[0009] However, the above method can only be applied to flip chips that do not need to be connected by gold wires, and cannot be used on chips that are generally connected by gold wires.

[0010] Moreover, in actual production, when the template 24 is separated from the substrate 21, the edge of the opening 241 will pull the phosphor layer 23 and cause defects on the edge of the phosphor layer 23, so as to affect the uniformity of the white light emitted by the light emitting diode.

[0011] It can be seen that the above-mentioned existing white light emitting diode manufacturing method obviously still has inconvenience and defects in method and use, and needs to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general method has no suitable production method to solve the above-mentioned problems. This is obviously a problem. Issues that relevant industry players are eager to solve

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