Plumbum-free soldering tin for electronic element and producing technique thereof
A technology of electronic components and lead-free solder, applied in the direction of welding media, welding equipment, welding/cutting media/materials, etc., can solve problems such as poor conductivity, easy oxidation of solder joints, and rough solder joints
Inactive Publication Date: 2009-04-15
叶志龙
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AI Technical Summary
Problems solved by technology
There are related technical reports on the lead-free solder formula, but relatively speaking, there are deficiencies such as poor electrical conductivity, rough solder joints, and easy oxidation of solder joints.
Method used
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Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0012] To produce 100 kg of lead-free solder:
[0013] (1) Weigh the raw materials of lead-free solder in proportion:
[0014] Sn: 90kg Ag: 2kg Bi: 7.5kg Cu: 0.5kg
[0015] (2) Put the raw material in the melting furnace and melt it evenly;
[0016] (3) Casting the melted alloy into ingots or bars.
[0017] To produce 50 kg of lead-free solder:
[0018] (1) Weigh the raw materials of lead-free solder in proportion:
[0019] Sn: 46kg Ag: 0.8kg Bi: 3kg Cu: 0.2kg
[0020] (2) Put the raw material in the melting furnace and melt it evenly;
[0021] (3) The melted alloy is burnt into wire.
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The present invention is lead-free soldering tin technology, and relates to soldering technology of electronic device and element. The lead-free soldering tin consists of Sn 88-99 wt%, Ag 0.1-3.2 wt%, Cu 0.3-0.8 wt%, Bi 0-8 wt% and Sb 0-8 wt%. The production process includes weighing the metal ingredients in certain proportion, melting in melting furnace and casting to form ingot, bar or filament. The lead-free soldering tin has high electric conductivity, smooth soldering point, less oxidation, no lead and environment friendship.
Description
Technical field: [0001] The invention relates to the lead-free solder formulation technology used in electronic components and devices. Background technique: [0002] Lead solder has been widely used for its excellent performance and low cost, but the environmental pollution of lead has been paid more and more attention all over the world. Now all electronic components and products are gradually banned from using lead-containing tin, and lead-free is gradually required. There are related technical reports on the lead-free solder formula, but relatively speaking, there are deficiencies such as poor electrical conductivity, rough solder joints, and easy oxidation of solder joints. Invention content: [0003] The purpose of the present invention is to provide a lead-free cadmium component, which is suitable for electronic components and devices, has good conductivity, smooth solder joints, and is not easy to oxidize the lead-free solder. [0004] The purpose of the present i...
Claims
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IPC IPC(8): B23K35/24
Inventor 叶志龙赖秋郎
Owner 叶志龙