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Three dimensional integrated micro mechanical acceleration sensor producing method

An acceleration sensor and acceleration sensing technology, which are applied in multi-dimensional acceleration measurement, acceleration measurement using inertial force, etc., can solve the problems of high paraxial sensitivity, easy interference in signal output, etc., achieving low production cost and easy final realization. Effect

Active Publication Date: 2009-06-03
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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Problems solved by technology

The common three-dimensional acceleration sensor is composed of a single sensitive element, and its sensitive element is a mass block-spring system composed of a sensitive mass block with multiple beams. This type of acceleration sensor is used in three directions in the same system. The minimum torsional mode that exists at the same time responds to the acceleration in the directions of X, Y and Z axes at the same time. However, it has high paraxial sensitivity, which leads to large coupling interference in the three directions, and the output of the signal is prone to interference.

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  • Three dimensional integrated micro mechanical acceleration sensor producing method
  • Three dimensional integrated micro mechanical acceleration sensor producing method
  • Three dimensional integrated micro mechanical acceleration sensor producing method

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Embodiment Construction

[0041] The substantive characteristics and remarkable progress of the present invention are further illustrated below through specific examples, but the present invention is by no means limited to the examples described.

[0042] Design and manufacturing process of a three-dimensional integrated high-shock acceleration sensor with a measuring range of 50,000 g:

[0043] 1. The structural size of the acceleration sensing element in the X and Y axis directions: the length of the cantilever beam is 515 μm, the thickness is 16 μm, and the width is 50 μm;

[0044] 2. The structural size of the acceleration sensing element on the Z axis: the thickness of the thin plate is 50 μm, the length is 50 μm, the thickness of the mass block is 370 μm, the total length of the mass block and the thin plate is 670 μm, and the width of the entire structure is 1400 μm.

[0045] The dimensions of the entire three-dimensional integrated high-shock acceleration sensor are: length 4100 μm, width 3500 ...

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Abstract

This invention relates to a high range acceleration sensor integrated by three dimensions characterizing that said sensor is integrated by three independent acceleration sensing elements, in which, the structures of the elements in X and Y shaft directions are the same arrayed vertically to each other and their sensitive direction is on the Si plane, the structure of that on the Z shaft is in another parallel to a side of those on the X and Y shafts and the sensitive direction is the vertical direction of silicon plate. The sensor is processed by MEMS routine technology and there is no interference among the sensitive elements of the three directions.

Description

technical field [0001] The invention relates to a three-dimensional integrated high-range micro-mechanical acceleration sensor and a manufacturing method thereof, belonging to the technical field of silicon micro-mechanical sensors. Background technique [0002] With the development of micro-mechanical system (MEMS) sensor technology, various MEMS sensors have attracted people's attention, among which micro-mechanical acceleration sensors have been widely used in different fields, such as automotive airbags, robot industry and automation control. However, in the monitoring process of various sports, the one-dimensional acceleration sensor can no longer meet the monitoring requirements well, so the three-dimensional acceleration sensor has become an important direction for the development of MEMS acceleration sensors. [0003] In recent years, there have been continuous reports on the development of monolithic integrated 3D acceleration sensors. The common three-dimensional ...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01P15/18G01P15/12
Inventor 李昕欣张鲲王跃林
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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