High wet sensitive electronic device element and its manufacturing method

Abstract

The component includes package shell and sealing material. The shell packages all high humidity sensitive electronic devices on base plate. The sealing material placed between the said base plate and the package shell encloses each electronic device or grouped multiple electronic devices so as to form complete airtight seat. The method is also disclosed.

Description

technical field [0001] The present invention relates to the control of the internal humidity of packaged electronic devices, in particular to a highly humidity-sensitive electronic device component with multiple highly humidity-sensitive electronic devices and its manufacturing method, so as to prevent premature device damage or premature reduction of device performance. Background technique [0002] In manufacturing, electronic devices are typically fabricated by processing large substrates containing multiple electronic devices. These substrates are typically selected from glass, plastic, metal, ceramic, silicon, other semiconductor materials, or combinations thereof. The substrate can be rigid or flexible and can be processed as individual units or as a continuous roll. The main reason for fabricating multiple electronic devices on large individual substrates or continuous roll substrates is to reduce production costs by reducing operations, increasing throughput and inc...

AI Technical Summary

Problems solved by technology

However, Boroson et al. do not teach a method for drying the environment around composite highly moisture-sensitive electronic device components sealed within multiple enclosures

Images