Miniature device for packing silicon microphone

A micro-device and microphone technology, which is applied in the direction of electrostatic transducer microphones, sensors, electrical components, etc., can solve the problems of less packaging literature and patent reports, and achieve the effects of avoiding environmental impact, saving costs, and reducing the thickness of the base

Active Publication Date: 2009-07-08
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Silicon microphone is a micro-electromechanical system (MEMS) sensor. Literature reports and patents on chip technology are common, but literature and patent reports on packaging are less

Method used

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  • Miniature device for packing silicon microphone
  • Miniature device for packing silicon microphone
  • Miniature device for packing silicon microphone

Examples

Experimental program
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Embodiment Construction

[0026] Such as figure 1 As shown, the package structure 11 proposed by the silicon microphone micro package of the present invention is composed of a metal cap 12 and a base 13 . The metal cap 12 is electrically connected to the base 13 to form an electromagnetic shielding cavity 30, thereby protecting the silicon micro-microphone chip 15, IC chip 16 and capacitor 17 packaged inside it from external electromagnetic interference. There are one or more small holes 14 on the top or side of the metal cap 12; there is an acoustic cavity 18 on the base, and these structures can ensure the acoustic requirements of the silicon microphone during operation.

[0027] Figure 2a , b are a cross-sectional view and a top view of the metal cap 12, respectively. The edge of the metal cap 12 is folded to form a small hem 19, which can be realized by stretching or punching. The crimping allows the metal cap 12 and the base 13 to have a large enough contact area to form a strong package. The...

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Abstract

The present invention is a miniature device for encapsulating a silicon microphone, which is composed of a metal cap and a base; the lower periphery of the metal cap is fixedly connected to the upper surface of the base, and is electrically connected to form a shielding cavity; a microelectromechanical system sensor chip and an IC chip The capacitor and capacitor are fixed on the base and located in the shielding cavity; there are sound holes on the top or side of the metal cap, and there is a sound cavity on the base. The micro-package of the silicon microphone of the present invention is a simple and easy package, which includes few process steps and can effectively save costs. Due to the use of a single-layer metal cap and a thin base, the package height can be reduced, the package volume can be effectively reduced, and the needs of current miniaturization of Bluetooth, hearing aids, mobile phones and other products can be met.

Description

technical field [0001] The invention relates to micro-electromechanical system (MEMS) sensor packaging, in particular to silicon micro-microphone chip packaging. Background technique [0002] A micro-electromechanical system (MEMS) sensor is a device that converts physical signals such as pressure, light, sound, etc. into electrical signals. With the development of micro-electro-mechanical systems (MEMS) technology, many micro-electro-mechanical systems (MEMS) sensor chips have been successfully developed. In order to protect fragile chips, connect with external circuit systems and reduce external interference, chips must be packaged. Microelectromechanical system (MEMS) packaging is another technical bottleneck after the development of microelectromechanical system (MEMS) chips. Its packaging continues to use the basic equipment and technology of integrated circuit (IC) and discrete device packaging, but microelectromechanical system (MEMS) sensors There are sensitive str...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/04H04R31/00
Inventor 宋青林王显彬梅嘉欣乔峰孙伟华姜滨
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
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