Circuit board and electric plating sludge resource recovery process

A technology for electroplating sludge and circuit boards, which is applied in the field of resource recycling technology, can solve problems such as environmental pollution, and achieve the effect of wide application range and overcoming limited application range.

Inactive Publication Date: 2009-08-26
上饶市华丰铜业有限公司
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Problems solved by technology

[0003] The present invention aims to provide a recycling process for recycling circuit boards and electroplating sludge. Through this process, metals such as copper, zinc, nickel, chromium and iron in circuit boards and electroplating sludge can be recycled to realize recycling Value, so as to solve the problem of environmental pollution, so that the resource utilization of nickel and zinc can meet the needs of a wider range of uses

Method used

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  • Circuit board and electric plating sludge resource recovery process

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Embodiment Construction

[0013] As shown in Figure 1, put the sludge into the leaching tank, add dilute sulfuric acid at a solid-to-liquid ratio of 1:0.6, stir at room temperature for 40 minutes, control the pH value of the end-point leaching solution to 1.5-2, then filter, The filtrate is pumped into the replacement tank, and the leaching residue is treated separately; in the filtrate of the replacement tank, iron filings are added according to 1.4 times the copper content of the filtrate, stirred at room temperature for 30 minutes, then filtered, and the filtrate is pumped into the zinc extraction tank to obtain For sponge copper containing 70-90% copper, add the sponge copper into coke, lime, and sand in proportion, mix well and place them in a blast furnace for rough refining to obtain crude copper ingots containing more than 95% copper; the filtrate in the zinc extraction tank NaOH was added to control the pH value of the filtrate to 1.5-3, according to the ratio of zinc to Na 2 Add 30% Na in the...

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Abstract

The invention discloses a recycling process of circuit board and electroplating sludge. The sludge is leached with dilute sulfuric acid, zinc and nickel are respectively precipitated by Na2S and pH value control, ferrochrome is recovered by liquid alkali precipitation, and ferrochrome is recovered by iron filings. The copper is replaced and recovered, and the leached tailings are solidified and used as building materials. The technology of the invention is reliable, and the zinc and nickel are effectively separated and extracted separately, which improves the utilization rate of zinc and nickel metal resources, reduces the discharge of waste, and realizes for environmental protection purposes.

Description

technical field [0001] The invention relates to a resource recovery process of IT circuit boards and electroplating sludge, in particular to a recovery process of nickel and zinc. Background technique [0002] "Nonferrous Metals Industry" (2000, No. 12, pages 45-47) disclosed: "Experimental Research on Extracting Copper and Nickel Sulfate from Electroplating Sludge", the process mainly includes leaching, replacement, purification, and preparation of sulfuric acid Nickel and curing treatment 5 parts. Dilute sulfuric acid is used for leaching and iron filings are used for replacement. The purification process is carried out step by step; the first step is to add an appropriate amount of Na 2 S; the second step is to add sodium chlorate and sodium carbonate solution to control the pH value; the third step is to adjust with NaOH solution, add an appropriate amount of NaF, and finally filter to separate the purification solution and purification residue. An appropriate amount ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C01G9/08C01G53/11C02F11/00
Inventor 徐仕华费文根程其文陈立强王树立
Owner 上饶市华丰铜业有限公司
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