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Circuit board and electric plating sludge resource recovery process

A technology of electroplating sludge and resource recovery, which is applied in the field of resource recovery technology, can solve problems such as environmental pollution, achieve a wide range of applications, and overcome the effects of limited application range

Inactive Publication Date: 2007-10-24
上饶市华丰铜业有限公司
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  • Abstract
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Problems solved by technology

[0003] The present invention aims to provide a recycling process for recycling circuit boards and electroplating sludge. Through this process, metals such as copper, zinc, nickel, chromium and iron in circuit boards and electroplating sludge can be recycled to realize recycling Value, so as to solve the problem of environmental pollution, so that the resource utilization of nickel and zinc can meet the needs of a wider range of uses

Method used

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  • Circuit board and electric plating sludge resource recovery process

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Embodiment Construction

[0013] As shown in Figure 1, put the sludge into the leaching tank, add dilute sulfuric acid according to the ratio of solid-liquid ratio of 1:0.6, stir at room temperature for 40 minutes, control the pH value of the end-point leachate to 1.5-2, then filter, and The filtrate is pumped into the replacement tank, and the leach slag is treated separately; in the filtrate of the replacement tank, iron filings are added according to 1.4 times the copper content of the filtrate, stirred at room temperature for 30 minutes, then filtered, and the filtrate is pumped into the zinc extraction tank to obtain Sponge copper containing 70-90% copper, adding sponge copper into coke, lime and sand in proportion, mixing well and putting them into blast furnace for rough refining to produce crude copper ingots containing more than 95% copper; the filtrate in the zinc extraction tank Add NaOH to control the pH value of the filtrate to 1.5-3, according to the ratio of zinc to Na 2 Add 30% Na in th...

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Abstract

The invention discloses a circuit board and resouring recycling technique of plated sludge, which is characterized by the following: leaching the sludge through dilute sulfuric acid; controlling Na2S and pH value to sediment zinc and nickel; recycling chromium iron through liquid alkaline sediment; using iron chips to replace and recycle copper; solidifying the leached tail slag as building material with reliable technique; separating and extracting zinc and nickel effectively; improving the utility of zinc and nickel resource; reducing the discharge of waste; realizing environmental protection.

Description

technical field [0001] The invention relates to a resource recovery process of IT circuit boards and electroplating sludge, in particular to a recovery process of nickel and zinc. Background technique [0002] "Nonferrous Metals Industry" (No. 12, pp. 45-47, 2000) disclosed: "Experimental Research on Extracting Copper and Nickel Sulfate from Electroplating Sludge", the process mainly includes leaching, replacement, purification, and preparation of sulfuric acid Nickel and curing treatment 5 parts. Dilute sulfuric acid is used for leaching and iron filings are used for replacement. The purification process is carried out step by step; the first step is to add an appropriate amount of Na 2 S; the second step is to add sodium chlorate and sodium carbonate solution to control the pH value; the third step is to adjust with NaOH solution, add an appropriate amount of NaF, and finally filter to separate the purification solution and purification residue. An appropriate amount of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01G9/08C01G53/11C02F11/00
Inventor 徐仕华费文根程其文陈立强王树立
Owner 上饶市华丰铜业有限公司
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