Power module, manufacturing method therefor, and air conditioner

Abstract

Disclosed is a power module which can be produced at low cost. Specifically disclosed is a power module (5, 5A, 5B, 5C, 5D, 5E, 5F) comprising a power semiconductor (53a), a non-power semiconductor (53b), a resin substrate (51, 51A, 51B, 51C, 51D, 51E, 51F) and a cooling means (59, 59A). The power semiconductor and the non-power semiconductor constitute a power supply circuit for performing power conversion. Both the power semiconductor and the non-power semiconductor are mounted on the resin substrate, and the cooling means is arranged for cooling the power semiconductor.

Description

technical field [0001] The invention relates to a power module for power conversion and a manufacturing method thereof. In addition, the present invention also relates to an air conditioner equipped with a power module. Background technique [0002] Generally, a power module is mainly composed of the following parts: a power semiconductor mounting substrate on which chips with relatively high heat generation such as power semiconductors are installed; a non-power semiconductor mounting substrate on which IC chips with relatively small heat generation such as microcomputers are mounted; A semiconductor cooling unit (for example, a heat sink, etc.) (for example, refer to Patent Document 1). [0003] Patent Document 1: Japanese Patent Laid-Open No. 2004-111619 [0004] However, generally, as a power semiconductor mounting substrate, since a large amount of heat generated by the power semiconductor needs to be dissipated to the outside of the system, a substrate made of alumin...

AI Technical Summary

Problems solved by technology

In general, mounting substrates made of aluminum or ceramics are more expensive than resin-made mounting substrates, and this is the main cause of the increase in the cost of power modules.

In addition, separately mounting power semiconductors and non-power semiconductors on these two types of mounting substrates leads to an increase in personnel costs and equipment costs when manufacturing power modules.

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