Leadless soft soldering material

Abstract

The present invention relates to a kind of lead-free soldering material, which is characterized in that it is composed of the following components by weight percentage: Ag 0.1-3.9%, La 0.01-1.0% and Sn balance, in the above-mentioned lead-free soldering 0.01 to 1.5% of Cu is also added to the material, and 0.001 to 0.05% of P and 0.001 to 0.05% of Ga are added to the above two lead-free solders. The lead-free solder of the present invention is SnAgLa ., SnAgLaCu, SnAg LaPGa and SnAg LaCuPGa have the advantages and effects of good wettability, strong oxidation resistance, bright solder joint surface, grain refinement, improved bending resistance, and reduced or eliminated solder joint bridging.

Description

technical field [0001] The invention relates to a lead-free solder material, which belongs to welding materials. Background technique [0002] With the enhancement of people's awareness of environmental protection and the increasingly perfect and strict environmental regulations, although tin-lead solder has the advantages of excellent wettability, solderability, good mechanical properties and low price, lead and its compounds are harmful to human health and pollution. Harmful and toxic substances in the environment, so the electronic industry needs lead-free solder to replace the traditional tin-lead solder, especially with the improvement of the weight, miniaturization and miniaturization of electronic products, the quality requirements of electronic products are more stringent , Most of the existing lead-free solders are SnAg, SnCu, SnAgCu, SnCuNi, and a few are mixed with rare earths. The disadvantages are that some have high melting points, some have coarse crystals, so...

AI Technical Summary

Problems solved by technology

[0002] With the enhancement of people's awareness of environmental protection and the increasingly perfect and strict environmental regulations, although tin-lead solder has the advantages of excellent wettability, solderability, good mechanical properties and low price, lead and its compounds are harmful to human health and pollution. Harmful and toxic substances in the environment, so the electronic industry needs lead-free solder to replace the traditional tin-lead solder, especially with the improvement of the weight, miniaturization and miniaturization of electronic products, the quality requirements of electronic products are more stringent , Most of the existing lead-free solders are SnAg, SnCu, SnAgCu, SnCuNi, and a few are mixed with rare earths. The disadvantages are that some have high melting points, some have coarse crystals, some have poor wettability, and some are easy to oxidize. Some are prone to segregation during the smelting process

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