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Heat radiator

A heat sink and heat sink technology, which is applied in the direction of instruments, instrument cooling, and electric solid devices, can solve the problems of small heat dissipation area, difficulty in distributing heat-generating electronic components efficiently, and low heat exchange coefficient, so as to achieve high heat dissipation efficiency.

Inactive Publication Date: 2010-02-24
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing heat sinks are generally flat plate with a small heat dissipation area, and it is difficult to form a vortex when the cooling airflow generated by the cooling fan flows through, resulting in a low heat exchange coefficient between the heat sink and the cooling airflow, and it is difficult to efficiently dissipate heat from electronic components. heat generated

Method used

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  • Heat radiator
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Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0012] figure 1 Shown is a first embodiment of the heat sink of the present invention. The heat sink 100 includes a plurality of cooling fins 10 , a heat pipe 20 and a base 30 , wherein the cooling fins 10 are superimposed on one end of the heat pipe 20 , and the other end of the heat pipe 20 is connected to the base 30 . A refrigerant fluid flows through the cooling fins 10 along the direction indicated by the arrow A.

[0013] Please refer to figure 2 The heat sink 10 includes a piece body 12, the piece body 12 is rectangular, the two opposite sides of the piece body 12 are respectively bent vertically to the same side to form a folded edge 14, and the two folded edges 14 are parallel to the flow direction of the refrigerant fluid, The sheet body 12 is provided with a flat plate portion 16 near a folded edge 14 thereof, and the flat plate portion 16 is provided with a perforation 162 corresponding to the heat pipe 20, and a joint portion 164 extends from the periphery of ...

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PUM

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Abstract

A radiator, for the dissemination of heat generated on the electronic components, includes some cooling pieces, at least one heat pipe and a base. Flow channels are formed between the cooling pieces for the refrigerant fluid to flow; one end of the heat pipe is closely joint with the cooling pieces, while the other end is connected with the base; a wave-shaped convex and concave surface is provided on the cooling pieces, and some protrusions are intervally disposed at the wave trough position of the wave-shaped convex and concave surface. The cooling heat area is increased and the heat exchange coefficient of the cooling pieces is improved by setting the wave-shaped convex and concave surface and the protrusions, thereby enhancing the cooling efficiency of the present inventive radiator.

Description

【Technical field】 [0001] The invention relates to a heat sink, in particular to a heat sink capable of quickly dissipating heat generated by heating electronic components. 【Background technique】 [0002] Nowadays, in the computer industry, in order to effectively dissipate the heat generated by heat-generating electronic components such as microprocessor chips, the usual method is to attach a heat sink to the surface of the heat-dissipating electronic components to assist the heat-generating electronic components to dissipate heat and ensure Heat-generating electronic components operate at the proper temperature. [0003] Existing radiators are generally composed of several heat sinks, heat pipes and bases, wherein the heat sinks are respectively provided with a perforation, and each heat sink is stacked on one end of the heat pipe through the perforation, and the other end of the heat pipe is connected to the heat pipe. The base is connected. The base is pasted on a heati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/427G06F1/20G12B15/06
Inventor 黄清白张杰朱习剑
Owner FU ZHUN PRECISION IND SHENZHEN