Micro heat radiation module
A heat dissipation module and miniature technology, which is applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve the problems that heat dissipation modules are difficult to use electronic devices, and it is difficult to manufacture fixed components8, etc., to improve assembly efficiency, The effect of reducing size and simplifying assembly components
Active Publication Date: 2010-02-24
SUNONWEALTH ELECTRIC MACHINE IND
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Problems solved by technology
The above-mentioned existing heat dissipation modules have the following disadvantages, for example: the existing heat dissipation modules must be respectively provided with the fixing component 8 and the assembly hole 73 to achieve the effect of stable positioning
However, when the size of the heat dissipation module is small enough to a certain extent, it is not easy to provide an assembly hole 73 sufficient to accommodate the fixing component 8 on the heat dissipation substrate 7, and it is also difficult to manufacture a small-sized fixing component 8, resulting in the existing heat dissipation module. Difficult to apply to such miniaturized electronic devices
Method used
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[0025] In order to make the above and other purposes, features and advantages of the present invention more obvious and understandable, the preferred embodiments of the present invention are specifically cited below, together with the accompanying drawings, as follows:
[0026] Please refer to figure 2 As shown, the miniature heat dissipation module of the first embodiment of the present invention includes a miniature heat dissipation substrate 1 and a miniature heat-dissipating fan 2, and the miniature heat-dissipating fan 2 is correspondingly positioned on the miniature heat dissipation substrate 1 to form a miniature heat dissipation module [ Not marked].
[0027] please refer again figure 2 As shown, the micro heat dissipation substrate 1 of the first embodiment of the present invention is made of a metal or alloy with high thermal conductivity, such as aluminum, copper, gold, silver or alloys thereof, and the micro heat dissipation substrate 1 preferably has a slight t...
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A micro heat dissipation module, comprising a micro heat dissipation substrate and micro heat dissipation blower. The micro heat dissipation substrate comprises a locating space, at least one airflowchannel and at least two locating part, with all of them mounted on a surface of the micro heat dissipation substrate, and the locating space is formed between at least two locating parts of the microheat dissipation substrate. The heat dissipation blower is provided with an air outlet, an air inlet and a fan wheel with rotary area thereof less than 1.6 square centimeters. The micro heat dissipation blower is bond into locating space of the micro heat dissipation substrate while being clamped by locating part of the substrate, and one of airflow outlet and airflow inlet is selected to correspond to one end of airflow channel. The invention is applicable to minimized electronic devices, and has effects of simplifying assembling structure and enhancing assembling efficiency.
Description
technical field [0001] The present invention relates to a miniature heat dissipation module, in particular to a miniature heat dissipation module which is provided with at least two positioning parts on a miniature heat dissipation substrate, through which a miniature heat-dissipating fan clip is firmly combined with the miniature heat dissipation substrate. module. Background technique [0002] For heat dissipation modules in the prior art, please refer to figure 1 As shown, it includes a heat dissipation substrate 7 , several fixing components 8 and a heat dissipation fan 9 . A surface of the heat dissipation substrate 7 is provided with a plurality of heat dissipation fins 71 and a plurality of heat dissipation channels 72 , and each of the heat dissipation channels 72 is formed between adjacent heat dissipation fins 71 . In addition, a plurality of assembling holes 73 are formed on the bottom surface of the heat dissipation channel 72 for the corresponding positioning ...
Claims
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IPC IPC(8): H05K7/20H05K7/02G06F1/20H01L23/40
Inventor 洪银树
Owner SUNONWEALTH ELECTRIC MACHINE IND