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Flat sheet type packaging of circuit assembly having metal block shaped electric contact terminal and method for making the same

A technology of electrical contact terminals and circuit components, which is applied in the direction of printed circuits connected with non-printed electrical components, printed circuits assembled with electrical components, etc., and can solve problems that cannot be applied to high-power applications

Active Publication Date: 2010-03-03
COMCHIP TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the impedance characteristics of its conductive path are adequate for small signal applications, it is not suitable for high power applications

Method used

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  • Flat sheet type packaging of circuit assembly having metal block shaped electric contact terminal and method for making the same
  • Flat sheet type packaging of circuit assembly having metal block shaped electric contact terminal and method for making the same
  • Flat sheet type packaging of circuit assembly having metal block shaped electric contact terminal and method for making the same

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Experimental program
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Embodiment Construction

[0026] figure 1 A perspective view showing the die face of the substrate used to fabricate the circuit assembly of the preferred embodiment of the flat chip package of the circuit assembly of the present invention. As shown in the figure, the substrate 100 used to carry the entire matrix arrangement, typically as many as hundreds of discrete circuit components, has a plurality of pairs of initial conductive lines 111A of the discrete circuit components on the surface of the die surface 110 . 111B, 112A, 112B, . . . and 116A, 116B, etc., are arranged in a two-dimensional orthogonal matrix as shown in the figure. Note that the substrate 100 itself, at an early stage of the fabrication process, is also used as the base carrier sheet for the bulk-fabricated, numerous circuit components of the present invention.

[0027] figure 1 The shown substrate, as the basis of the discrete circuit assembly of the present invention, the entire substrate is a plate with good electrical conduc...

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PUM

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Abstract

This invention discloses one wireless lead leg plat sealing in circuit elements, which comprises one flat sealed body and at least two electrical contact terminal, wherein, flat sealed body compriseswater and gas tight sealed materials and circuit elements at least one circuit element transistor; the terminals are connected to relative circuit joints of circuit element particles and each terminalcomprises one level welding surface welded on the outer surface; the level tin surface can weld the terminal on one printing circuit board cushions on the printing circuit board.

Description

technical field [0001] The present invention generally relates to a package of circuit components, and more particularly, to a contact terminal suitable for low-cost, high-efficiency automated mass production, having good electrical conductivity, and having good heat dissipation properties, suitable for Flat Package for high power circuit components. Background technique [0002] Active and passive circuit components, such as diodes, transistors, resistors and capacitors, are circuit components widely used in electronic circuits. Regardless of whether it is for small signal or high power applications, linear or digital circuits need to be applied to discrete circuit components of these different properties. In addition to diodes, resistors, and capacitors integrated in integrated circuits, diodes, resistors, and capacitors in the form of discrete components are electronic components that are widely used. [0003] Discrete circuit assemblies come in various types of packagi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18H05K3/34
Inventor 陈文隆胡志良陈炳南梁明忠
Owner COMCHIP TECH