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High flexible copper-clad laminate manufacturing method

A manufacturing method and flexible technology, which are applied in the manufacturing field of high-flexibility flexible copper-clad laminates, and can solve problems such as poor transportability

Active Publication Date: 2010-03-17
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, there is also the problem of poor transportability due to creases caused by heat shrinkage of the copper foil.

Method used

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  • High flexible copper-clad laminate manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

Synthetic example 2

Embodiment 1

[0031] An electrolytic copper foil 1 (HL foil manufactured by Nippon Denkai Co., Ltd., average crystal particle diameter before heat treatment: 1.0 μm) having a thickness of 12 μm was prepared. The polyimide precursor resin solution b obtained in Synthesis Example 2 was uniformly coated on the copper foil so that the thickness after curing was about 2 μm, and then heated and dried at 130° C. to remove the dissolved coal. Next, the polyimide resin precursor solution a prepared in Synthesis Example 1 was uniformly coated thereon in a layered manner so that the thickness after curing was about 20 μm, and the solvent was removed by heating and drying at 135° C. Then, the polyimide resin precursor solution b was uniformly coated on the polyimide layer so that the thickness after curing was about 3 μm, and the solvent was removed by heating and drying at 130° C.

[0032] The laminated body was then subjected to a heat treatment step of stepwise heating at 130° C. to 380° C. for 10 m...

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Abstract

The aim of the invention is to stably manufacture a flexible copper clad laminate comprising a copper foil of superior flexibility and a polyimide resin layer. In a method for manufacturing a copper clad laminate comprising the copper foil and the polyimide resin layer by applying a polyimide precursor resin solution to the surface of the copper foil and then drying and hardening in a following heat treatment process, by maintaining 3-40 minutes in the temperature range of 300-450 DEG C in the heat treatment process by using an electrolytic copper foil as the copper foil, wherein the average crystal grain diameter of the copper foil grows up 2-8 times of that before the heat treatment process.

Description

technical field [0001] The present invention relates to a method of manufacturing a flexible copper-clad laminate used in an electronic device (hereinafter simply referred to as a copper-clad laminate), and more particularly to a method of manufacturing a highly bendable flexible copper-clad laminate excellent in high bending properties. Background technique [0002] Flexible copper-clad laminates are widely used in electronic devices that require flexibility, flexibility, and high-density assembly, such as movable parts in hard disks or hinge parts of mobile phones. In recent years, as devices have become smaller and more advanced, the number of cases where copper-clad laminates are bent and stored in narrow spaces has increased. Since the bending angle of the copper-clad laminate itself has also become an acute angle, Therefore, it is indispensable to provide a copper-clad laminate with higher bendability. [0003] Based on this background, as a method of improving the be...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00C22C9/00C22F1/08C25D1/04
CPCB32B15/08B32B15/20B32B27/281B32B37/0038
Inventor 福田夏树服部公一
Owner NIPPON STEEL CHEM &MATERIAL CO LTD