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Manual pasting method for mobile phone camera module group

A camera module and manual technology, which is applied in the direction of camera, electrical component assembly printed circuit, optics, etc., can solve the problems of mobile phone manufacturing enterprises being overwhelmed, too many consumables, and the high cost of automatic placement process, so as to improve the proofing efficiency and save cost, and the effect of improving timeliness

Active Publication Date: 2010-03-24
SHANGHAI LAIMU ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing automated chip placement process for mobile phone camera modules has high costs and many consumables, which make mobile phone manufacturers overwhelmed

Method used

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  • Manual pasting method for mobile phone camera module group
  • Manual pasting method for mobile phone camera module group
  • Manual pasting method for mobile phone camera module group

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] Cooperate see Figure 1 to Figure 6 , the mobile phone camera module manual placement method of the present invention is, at first on each FPC veneer 1 (as figure 1 shown) or PCB single board 2 (such as image 3 Brush tin on the pads 11 and 21 as shown), the specific method is to use an electric soldering iron (temperature 350 degrees) to weld the solder wire on the pads under a magnifying glass of 40 times. The height of the tin should be the same. Then brush a layer of solder paste 3 on the solder of each FPC single board or PCB single board pad (see Figure 5 ); then place the entire FPC board or PCB board 4 on the product positioning aluminum plate 5 and fix it; If the wafer used is Micron wafer 7 (such as figure 2 As shown), it is also necessary to brush tin on wafer pad 71. The specific method is to use an electric soldering iron (temperature 350 degrees) to weld the solder wire on the pad under a magnifying glass of 40 times. same height. If the wafer used...

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Abstract

A manual patching method of a mobile phone camera module includes the steps of brushing tin on the bonding pad of an FPC plate or a PCB plate, brushing solder paste on the soldering tin, fixing the whole piece of FPC plate or PCB plate on the special product locating plate, covering the whole piece of FPC plate or PCB plate by a special wafer locating plate, putting each wafer in each wafer locating frame, pre-heating the heating platform, putting the product locating plate on the heating platform and heating, cooling, welding each connector on the connector bonding pad of each FPC plate or PCB plate. The method of the invention has greater advantage to the products in small batches and the sampling products patches, the method saves cost of manufacturing tools and improves sampling efficiency, however the products change, the method can save cost and improve the timeliness of sampling products.

Description

technical field [0001] The invention relates to the manufacture of mobile phones, in particular to a manual patching method for camera modules of mobile phones. Background technique [0002] The imaging principle of the mobile phone camera module is: the mobile phone camera module is installed on a specific test device, and the test device connects the signal line, data line, and power line on the camera module to the test circuit board, and the test circuit board passes through the USB port. communicate with the computer. Driven by the computer, the test circuit board converts the optical signal collected by the camera module into an electrical signal, and then transmits the electrical signal to the computer. The computer program restores the electrical signal to image information, and displays the video signal on the computer screen. The image recorded by the module. According to the image, the operator determines whether the imaging is normal and adjusts the definition ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34H05K13/04G03B29/00
Inventor 朱新爱卢青青
Owner SHANGHAI LAIMU ELECTRONICS