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Flash memory packaging method and structure thereof

A packaging method and packaging structure technology, applied to recording carriers, instruments, electrical components, etc. used in machines, can solve the problems of high cost, low productivity, expensive cutting equipment, etc.

Inactive Publication Date: 2007-08-01
卓恩民
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, laser machines and water jets are quite expensive equipment, and water jet equipment even needs to purchase additional abrasives (abrasive) to achieve the cutting function; in addition, no matter whether water jet or laser cutting is used for the cutting process , must spend more time for precise calibration and slow cutting, and the productivity is relatively low
[0004] In order to achieve the requirement of cutting products without burrs, expensive cutting equipment, low output rate, and high cost are the fly in the ointment

Method used

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  • Flash memory packaging method and structure thereof
  • Flash memory packaging method and structure thereof
  • Flash memory packaging method and structure thereof

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Experimental program
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Embodiment Construction

[0043] The packaging method and structure of the flash memory card according to an embodiment of the present invention will be described below with preferred embodiments.

[0044] First, please refer to FIG. 3A , which is a schematic diagram of a substrate design according to an embodiment of the present invention. As shown in the figure, in this embodiment, a substrate 10 has several memory card module substrates 20 disposed thereon, and each memory card module substrate 20 is suspended in contact with the substrate 10 with several connecting sections 22, connected Between the segments 22 is the hollow area of ​​the substrate 10 ; as shown in FIG. 3B , it is a schematic diagram of a stamping and cutting structure according to an embodiment of the present invention. After placing the chip (not shown in the figure) on the appropriate position in the memory card module substrate 20, use a molding compound (moldingcompound) 30, such as an epoxy resin material, to cover each memor...

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Abstract

This invention relates to one flash memory card sealing method and its structure, which sets several memory card modules on baseboard connected to connection sections and baseboard, wherein, when putting chips in proper position through sealing materials with coverage area larger than memory card module baseboard through impacting and polishing to remove angle connection section to expose protruding part to achieve need. This invention cuts baseboard connection sections to isolate baseboard and memory card by impacting type.

Description

technical field [0001] The invention relates to a semiconductor packaging technology, in particular to a packaging method and structure of a flash memory card. Background technique [0002] Micro Secure Digital Memory Card (micro SDCard) is a very lightweight portable data storage device that can be used in various electronic devices, such as personal computers, mobile phones, digital cameras...etc. . In the known dicing process of micro SD memory cards, several packages after molding are cut into individual packages. As shown in Fig. 1A and Fig. 1B, Fig. 1A and Fig. 1B are respectively the front view and the rear view of the miniature secure digital memory card, the shape of the miniature SD card 100 is polygonal and has a protrusion and a concave shape 102 on one side thereof . [0003] Referring to FIG. 2, it is a schematic front view of a generally known method for forming a single micro SD card. Several single micro SD card module substrates 120 are arranged on a sub...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077H01L21/50
CPCH01L2224/97H01L2924/181
Inventor 卓恩民
Owner 卓恩民