Method for siphon prevention of the terminal and the terminal made by this method

Abstract

The invention discloses an anti-siphonage method of ends, the ends includes guiding connection part which is welded with the outer element by solder, and connection part which is extended by the guiding connection part, the surface of the connection part is naked and made of copper, the copper is oxidized to form oxide. The ends of the invention includes connection part and guiding connection part, thereinto, the connection par extends to form the guiding connection part, the guiding connection part can be connected with outer element by solder, the connection part is made of copper which can be oxidized and naked. Because the invention comprises copper which can be oxidized and naked, the copper is oxidized to form oxide, the oxide such as copper-oxide can avoid the solder siphoned from the guiding connection part to the ends connection part during the welding, it can save the solder and avoid the phenomenon of empty welding, the quality of welding can be guaranteed and the cost is saved.

Description

【Technical field】 [0001] The invention relates to a method for making a terminal anti-siphon and a terminal manufactured by the method. 【Background technique】 [0002] At present, electrical connectors are required to electrically connect electronic components such as chip modules or adapter cards to circuit boards. Such electrical connectors are generally provided with conductive terminals, and one end of the conductive terminals (ie, the contact portion) is connected to the chip module. Or the electronic components such as the adapter card are in electrical contact, and the other end (ie, the soldering end) is welded and fixed on the circuit board, so that the electrical connection between the chip module or the adapter card and other electronic components and the circuit board can be realized. [0003] But the existing conductive terminal is welded and fixed on the circuit board by being provided with solder at the soldering end of the conductive terminal, and then meltin...

AI Technical Summary

Problems solved by technology

[0003] But the existing conductive terminal is welded and fixed on the circuit board by being provided with solder at the soldering end of the conductive terminal, and then melting the solder so that the conductive terminal is welded and fixed on the circuit board, but after the solder is melted, due to the surface electroplating of the conductive terminal There is gold, and the gold plating layer is prone to produce small details, which will cause a siphon phenomenon during the soldering process of the conductive terminal, and make the solder siphon from the welding end of the conductive terminal to the contact part of the conductive terminal, causing a large amount of solder loss and easy to cause empty welding. Seriously affect the electrical connection between the conductive terminal and the circuit board

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